ADA4311-1
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 13.6 V
Power Dissipation (T
JMAX
− T
A
)/θ
JA
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Thermal resistance (θ
JA
) is specified for the worst-case conditions,
that is, θ
JA
is specified for device soldered in circuit board for
surface-mount packages.
Table 3.
Package Type θ
JA
Unit
10-Lead MINI_SO_EP 44 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4311-1 is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 3 shows the maximum safe power dissipation in
the package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.
θ
JA
values are approximations.
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–35 –15 5 25 45 65 85
MINI_SO_EP-10
06940-003
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
