TJA1042 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 10 — 24 November 2017 19 of 26
NXP Semiconductors
TJA1042
High-speed CAN transceiver with Standby mode
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13
.
Table 9. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
TJA1042 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 10 — 24 November 2017 20 of 26
NXP Semiconductors
TJA1042
High-speed CAN transceiver with Standby mode
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 16 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
AN10365 ‘Surface mount reflow soldering description”
AN10366 “HVQFN application information”
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
TJA1042 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 10 — 24 November 2017 21 of 26
NXP Semiconductors
TJA1042
High-speed CAN transceiver with Standby mode
18. Appendix: ISO 11898-2:2016 parameter cross-reference list
Table 11. ISO 11898-2:2016 to NXP data sheet parameter conversion
ISO 11898-2:2016 NXP data sheet
Parameter Notation Symbol Parameter
HS-PMA dominant output characteristics
Single ended voltage on CAN_H V
CAN_H
V
O(dom)
dominant output voltage
Single ended voltage on CAN_L V
CAN_L
Differential voltage on normal bus load V
Diff
V
O(dif)
differential output voltage
Differential voltage on effective resistance during arbitration
Optional: Differential voltage on extended bus load range
HS-PMA driver symmetry
Driver symmetry V
SYM
V
TXsym
transmitter voltage symmetry
Maximum HS-PMA driver output current
Absolute current on CAN_H I
CAN_H
I
O(sc)dom
dominant short-circuit output
current
Absolute current on CAN_L I
CAN_L
HS-PMA recessive output characteristics, bus biasing active/inactive
Single ended output voltage on CAN_H V
CAN_H
V
O(rec)
recessive output voltage
Single ended output voltage on CAN_L V
CAN_L
Differential output voltage V
Diff
V
O(dif)
differential output voltage
Optional HS-PMA transmit dominant timeout
Transmit dominant timeout, long t
dom
t
to(dom)TXD
TXD dominant time-out time
Transmit dominant timeout, short
HS-PMA static receiver input characteristics, bus biasing active/inactive
Recessive state differential input voltage range
Dominant state differential input voltage range
V
Diff
V
th(RX)dif
differential receiver threshold
voltage
V
rec(RX)
receiver recessive voltage
V
dom(RX)
receiver dominant voltage
HS-PMA receiver input resistance (matching)
Differential internal resistance R
Diff
R
i(dif)
differential input resistance
Single ended internal resistance R
CAN_H
R
CAN_L
R
i
input resistance
Matching of internal resistance MR R
i
input resistance deviation
HS-PMA implementation loop delay requirement
Loop delay t
Loop
t
d(TXDH-RXDH)
delay time from TXD HIGH to
RXD HIGH
t
d(TXDL-RXDL)
delay time from TXD LOW to RXD
LOW
Optional HS-PMA implementation data signal timing requirements for use with bit rates above 1 Mbit/s up to
2 Mbit/s and above 2 Mbit/s up to 5 Mbit/s
Transmitted recessive bit width @ 2 Mbit/s / @ 5 Mbit/s,
intended
t
Bit(Bus)
t
bit(bus)
transmitted recessive bit width
Received recessive bit width @ 2 Mbit/s / @ 5 Mbit/s t
Bit(RXD)
t
bit(RXD)
bit time on pin RXD
Receiver timing symmetry @ 2 Mbit/s / @ 5 Mbit/s t
Rec
t
rec
receiver timing symmetry

TJA1042T,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
CAN Interface IC CAN 1Mbps Standby 3.3V/5V 8-Pin
Lifecycle:
New from this manufacturer.
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