5
Table 4. Absolute Maximum Ratings
Parameter Symbol Min Max Units Note
Storage Temperature T
S
–55 125 °C
Operating Temperature T
A
–40 105 °C
Input Current, Average I
IN
50 mA 1
Input Current, Surge I
IN
140 mA 1, 2
Input Current, Transient I
IN
500 mA 1, 2
Input Voltage (Pins 2-3) V
IN
–0.5 V
Input Power Dissipation P
IN
200 mW 3
Total Package Power Dissipation P
T
269 mW 4
Output Power Dissipation P
O
163 mW 5
Output Current, Average I
O
30 mA 6
Supply Voltage (Pins 8-5) V
CC
–0.5 20 V
Output Voltage (Pins 6-5) V
O
–0.5 20 V
Lead Solder Temperature 260°C for 10 seconds, measured at 1.6 mm below seating plane.
Notes:
1. Current into or out of any single lead.
2. Surge input current duration is 3 ms at a 120 Hz pulse repetition rate. Transient input current duration is 10 μs at a 120 Hz pulse repetition rate. Note
that the maximum input power, PIN, must be observed.
3. Derate linearly above 105°C free-air temperature at a rate of 10 mW / °C. The maximum input power dissipation of 200 mW allows an input IC
junction temperature of 125°C at an ambient temperature of T
A
= 105°C. Excessive P
IN
and T
J
may result in IC chip degradation.
4. Derate linearly above 105°C free-air temperature at a rate of 13.5 mW / °C.
5. Derate linearly above 105°C free-air temperature at a rate of 8.2 mW / °C. A maximum output power dissipation of 163 mW allows an output IC
junction temperature of 125°C at an ambient temperature of T
A
= 105°C.
6. Derate linearly above 105°C free-air temperature at a rate of 1.5 mA / °C.
Table 5. Recommended Operating Conditions
Parameter Symbol Min Max Units Note
Supply Voltage V
CC
218V
Operating Temperature T
A
–40 105 °C
Operating Frequency, V
CC
= 5 V f 0 9 kHz 1
Operating Frequency, V
CC
= 3.3 V f 0 5 kHz 1
Notes:
1. Maximum operating frequency is dened when the output waveform at pin 6 obtains only 90% of V
CC
with R
L
= 4.7 k:, C
L
= 30 pF using a 5 V
square wave input signal.
