BUK753R4-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 21 April 2011 4 of 14
NXP Semiconductors
BUK753R4-30B
N-channel TrenchMOS standard level FET
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
003aab196
0
50
100
150
200
250
0 50 100 150 200
T
j
(
°
C)
I
D
(A)
(1)
T
mb
(°C)
0 20015050 100
03na19
40
80
120
P
der
(%)
0
003aab185
1
10
10
2
10
3
10
4
10
-1
1 10 10
2
V
DS
(V)
I
D
(A)
DC
100 ms
10 ms
limit R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10
μ
s
100
μ
s
(1)
BUK753R4-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 21 April 2011 5 of 14
NXP Semiconductors
BUK753R4-30B
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting base
--0.59K/W
R
th(j-a)
thermal resistance from
junction to ambient
vertical in free air - 60 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
003aab186
single shot
0.2
0.1
0.05
0.02
10
-3
10
-2
10
-1
1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
Z
th(j-mb)
(K/W)
δ
= 0.5
t
p
T
P
t
t
p
T
δ =
BUK753R4-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 21 April 2011 6 of 14
NXP Semiconductors
BUK753R4-30B
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
=25A; V
GS
=0V; T
j
= -55 °C 27 - - V
I
D
=25A; V
GS
=0V; T
j
=25°C 30--V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
=V
GS
; T
j
=2C;
see Figure 10; see Figure 11
234V
V
GSth
gate-source threshold
voltage
I
D
=1mA; V
DS
=V
GS
; T
j
=-5C;
see Figure 10
; see Figure 11
--4.4V
I
D
=1mA; V
DS
=V
GS
; T
j
= 175 °C;
see Figure 10; see Figure 11
1--V
I
DSS
drain leakage current V
DS
=30V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
I
GSS
gate leakage current V
GS
=20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
=2C;
see Figure 12; see Figure 13
-2.93.4m
V
GS
=10V; I
D
=25A; T
j
= 175 °C;
see Figure 12
; see Figure 13
--6.5m
I
DSS
drain leakage current V
DS
=30V; V
GS
=0V; T
j
= 175 °C - - 500 µA
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=24V; V
GS
=10V;
see Figure 14
-75-nC
Q
GS
gate-source charge - 19 - nC
Q
GD
gate-drain charge - 23 - nC
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
=2C; see Figure 15
- 3713 4951 pF
C
oss
output capacitance - 1249 1499 pF
C
rss
reverse transfer
capacitance
- 460 630 pF
t
d(on)
turn-on delay time V
DS
=30V; R
L
=1.2; V
GS
=10V;
R
G(ext)
=10
-32-ns
t
r
rise time - 64 - ns
t
d(off)
turn-off delay time - 89 - ns
t
f
fall time - 71 - ns
L
D
internal drain
inductance
from contact screw on mounting base to
centre of die
-3.5-nH
from drain lead 6 mm from package to
centre of die
-4.5-nH
L
S
internal source
inductance
from source lead to source bond pad - 7.5 - nH
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
=2C;
see Figure 16
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs; V
GS
=0V;
V
DS
=30V
-70-ns
Q
r
recovered charge - 58 - nC

BUK753R4-30B,127

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF Bipolar Transistors MOSFET Trans MOSFET N-CH 30V 198A 3Pin(3+Tab)
Lifecycle:
New from this manufacturer.
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