NCV7321
www.onsemi.com
4
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Typ Max Unit
V
BB
Voltage on Pin V
BB
−0.3 +45 V
V
LIN
LIN Bus Voltage −45 +45 V
V
WAKE
DC Voltage on WAKE Pin −35 +45 V
V
INH
DC Voltage on INH Pin −0.3 V
BB
+ 0.3 V
I
INH
DC Current from INH Pin 50 mA
V_Dig_IO DC Input Voltage on Pins (EN, RxD, TxD) −0.3 +45 V
T
J
Maximum Junction Temperature −40 +150 °C
V
ESD
HBM (All Pins) (Note 8) −4 +4 kV
CDM (All Pins) (Note 9) −750 +750 V
Version NCV7321D10:
HBM (LIN, INH, V
BB
, WAKE) (Note 10)
System HBM (LIN, V
BB
, WAKE) (Note 11)
−5
−5
+5
+5
kV
kV
Version NCV7321D11/D12/MW2:
HBM (LIN, INH, V
BB
, WAKE) (Note 10)
System HBM (V
BB
, WAKE) (Note 12)
System HBM (LIN) (Note 12)
−8
−6
−10
+8
+6
+10
kV
kV
kV
Version NCV7321D12/MW2:
Powered ESD (LIN), Contact/Air, 330 pF / 2 kW (Note 13)
Powered ESD (LIN), Air, 150 pF / 2 kW (Note 13)
−15
−25
+15
+25
kV
kV
V
TRAN
Version NCV7321D12/MW2;
Voltage transients (DCC method), pin LIN
According to SAE J2962−1, Class C (Note 14)
−85 +85 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
8. Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor conform to MIL STD 883 method 3015.7.
9. Charged device model test according to ESD STM5.3.1−1999.
10.Equivalent to discharging a 100 pF capacitor through a 1.5 kW resistor referenced to GND.
11. Equivalent to discharging a 150 pF capacitor through a 330 W resistor. 220 nF filter on LIN pin. System HBM levels are verified by an external
test−house.
12.Equivalent to discharging a 150 pF capacitor through a 330 W resistor. No filter on LIN pin. System HBM levels are verified by an external
test−house.
13.Powered ESD test method according to SAE J2962−1 specification, referring to ISO 10605. Verified by an external test house.
14.Direct Capacitor Coupling (DCC) method according to SAE J2962−1 specification, referring to ISO 7637−3 Slow Transient Pulse. Coupling
Capacitor 10 nF. Tested with no external protections. Verified by an external test house.
NCV7321
www.onsemi.com
5
FUNCTIONAL DESCRIPTION
Overall Functional Description
LIN is a serial communication protocol that efficiently
supports the control of mechatronic nodes in distributed
automotive applications. The domain is class−A multiplex
buses with a single master node and a set of slave nodes.
The NCV7321 contains the LIN transmitter, LIN receiver,
power−on−reset (POR) circuits and thermal shutdown
(TSD). The LIN transmitter is optimized for the maximum
specified transmission speed of 20 kB with EMC
performance due to reduced slew rate of the LIN output.
The junction temperature is monitored via a thermal
shutdown circuit that switches the LIN transmitter off when
temperature exceeds the TSD trigger level.
The NCV7321 has four operating states (unpowered
mode, standby mode, normal mode and sleep mode) that are
determined by the supply voltage V
BB
, input signals EN and
WAKE and activity on the LIN bus.
OPERATING STATES
Sleep Mode
Normal modeStandby mode
Unpowered
Figure 3. State Diagram
LIN Wake−Up or Local Wake−Up
EN = High for t > T_enable
EN = High for t > T_enable
EN = Low for t > T_disable
− LIN Transceiver: OFF
− LIN Term: 30 kW
− INH Pin = High
− RxD: Low After a Wake−up/
Floating Otherwise
− TxD: Wake−up Source Flag
− LIN Transceiver: OFF
− LIN Term: Floating
− INH Pin: Floating
− RxD: Floating
− TxD: Weak Pull−down
− LIN Transceiver: OFF
− LIN Term: Current Source
− INH Pin: Floating
− RxD: Floating
− TxD: Weak Pull−down
− LIN Transceiver: ON
− LIN Term: 30 kW
− INH Pin: High
− RxD: Received LIN Data
− TxD: Weak Pull−down
Transmitter Input
(V
BB
Below Reset Level)
V
BB
Above Reset Level
Unpowered Mode
As long as V
BB
remains below its power−on−reset level,
the chip is kept in a safe unpowered state. LIN transmitter is
inactive, both LIN and INH pins are left floating and only a
weak pull−down is connected on pin TxD. Pin RxD remains
floating.
The unpowered state will be entered from any other state
when V
BB
falls below its power−on−reset level.
Standby Mode
Standby mode is a low−power mode, where LIN
transceiver remains inactive while INH pin is driven high to
activate an external voltage regulator – see Figure 2.
Depending on the transition which led to the standby mode,
pins RxD and TxD are configured differently during this
mode. A 30 kW resistor in series with a reverse−protection
diode is internally connected between LIN and V
BB
Pins.
Standby mode is entered in one of the following ways:
After the voltage level at V
BB
pin rises above its
power−on−reset level. In this case, RxD Pin remains
high−impedant and the pull−down applied on pin TxD
remains weak.
After a wake−up event is recognized while the chip was
in the sleep mode. Pin RxD is pulled low while pin
TxD signals the type of wake−up leading to the standby
mode – its pull−up remains weak for LIN wake−up and
it is switched to strong pull−down for the case of local
wake−up (i.e. wake−up via Pin WAKE).
While in the standby mode, the configuration of Pins RxD
and TxD remains unchanged, regardless the activity on
WAKE and LIN Pins – i.e. if additional wake−ups occur
during the standby mode, they have no influence on the chip
configuration.
Normal Mode
In normal mode, the full functionality of the LIN
transceiver is available. Data according the state of TxD
input are sent to the LIN bus while pin RxD reflects the
logical symbol received on the LIN bus – high−impedant for
recessive and Low for dominant. A 30 kW resistor in series
NCV7321
www.onsemi.com
6
with a reverse−protection diode is internally connected
between LIN and V
BB
pins.
To avoid that, due to a failure of the application (e.g.
software error), the LIN bus is permanently driven dominant
and thus blocking all subsequent communication, signal on
pin TxD passes through a timer, which releases the bus in
case TxD remains low for longer than T_TxD_timeout. The
transmission can continue once the TxD returns to High
logical level.
In case the junction temperature increases above the
thermal shutdown threshold, e.g. due to a short of the LIN
wiring to the battery, the transmitter is disabled and releases
LIN bus to recessive. Once the junction temperature
decreases back below the thermal shutdown release level,
the transmission can be enabled again – however, to avoid
thermal oscillations, first a High logical level on TxD must
be encountered before the transmitter is enabled.
As required by SAE J2602, the transceiver must behave
safely below its operating range – it shall either continue to
transmit correctly (according its specification) or remain
silent (transmit a recessive state regardless of the TxD
signal). A battery monitoring circuit in NCV7321
de−activates the transmitter in the normal mode if the V
BB
level drops below MONL_V
BB
. Transmission is enabled
again when V
BB
reaches MONH_V
BB
. The internal logic
remains in the normal mode and the reception from the LIN
line is still possible even if the battery monitor disables the
transmission. Although the specifications of the monitoring
and power−on−reset levels are overlapping, it’s ensured by
the implementation that the monitoring level never falls
below the power−on−reset level.
Normal mode can be entered from either standby or sleep
mode when EN Pin is High for longer than T_enable. When
the transition is made from standby mode, TxD pull−down
is set to weak and RxD is put high−impedant immediately
after EN becomes High (before the expiration of T_enable
filtering time). This excludes signal conflicts between the
standby mode pin settings and the signals required to control
the chip in the normal mode (e.g. strong pull−down on TxD
after local wake−up vs. High logical level on TxD required
to send a recessive symbol on LIN).
Sleep Mode
Sleep mode provides extremely low current consumption.
The LIN transceiver is inactive and the battery consumption
is minimized. Pin INH is put to high−impedant state to
disable the external regulator and, in case of a master node,
the LIN termination – see Figure 2. Only a weak pull−up
current source is internally connected between LIN and
V
BB
Pins, in order to minimize current consumption even in
case of LIN short to GND.
Sleep mode can be entered from normal mode by
assigning Low logical level to pin EN for longer than
T_disable. The sleep mode can be entered even if a
permanent short occurs either on LIN or WAKE Pin.
If a wake−up event occurs during the transition between
normal and sleep mode (during the T_disable filtering time),
it will be regarded as valid wake−up and the chip will enter
standby mode with the appropriate setting of Pins RxD and
TxD.
Wake−up
Two types of wake−up events are recognized by NCV7321:
Local wake−up – when a high−to−low transition on pin
WAKE is encountered and WAKE pin remains Low at
least during T_WAKE – see Figure 4.
Remote (or LIN) wake−up – when LIN bus is
externally driven dominant during longer than
T_LIN_wake and a rising edge on LIN occurs
afterwards – see Figure 5.
Wake−up events can be exclusively detected in sleep mode
or during the transition from normal mode to sleep mode.
Due to timing tolerances, valid wake−up events beginning
shortly before normal−to−sleep mode transition can be also
sometimes regarded as valid wake−ups.
WAKE
t
V
BB
Local Wake−up recognized
Sleep Mode Standby Mode
V_WAKE_th
T_WAKE
Figure 4. Local Wake−up Detection

NCV7321D12R2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
LIN Transceivers ESD IMPROVED LINANSC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union