22
LTC2401/LTC2402
used to shift the conversion result into external circuitry.
After the 32nd rising edge, CS is pulled HIGH and a new
conversion is immediately started. This is useful in appli-
cations requiring periodic monitoring and ultralow power.
Figure 14 shows the average supply current as a function
of capacitance on CS.
It should be noticed that the external capacitor discharge
current is kept very small in order to decrease the con-
verter power dissipation in the sleep state. In the autostart
mode the analog voltage on the CS pin cannot be observed
without disturbing the converter operation using a regular
oscilloscope probe. When using this configuration, it is
important to minimize the external leakage current at the
CS pin by using a low leakage external capacitor and
properly cleaning the PCB surface.
The internal serial clock mode is selected every time the
voltage on the CS pin crosses an internal threshold volt-
age. An internal weak pull-up at the SCK pin is active while
CS is discharging; therefore, the internal serial clock
timing mode is automatically selected if SCK is floating. It
is important to ensure there are no external drivers pulling
SCK LOW while CS is discharging.
as 100µs. However, some considerations are required to
take advantage of exceptional accuracy and low supply
current.
The digital output signals (SDO and SCK in Internal SCK
mode of operation) are less of a concern because they are
not generally active during the conversion state.
In order to preserve the LTC2401/LTC2402’s accuracy, it
is very important to minimize the ground path impedance
which may appear in series with the input and/or reference
signal and to reduce the current which may flow through
this path. The GND pin should be connected to a low
resistance ground plane through a minimum length trace.
The use of multiple via holes is recommended to further
reduce the connection resistance.
In an alternative configuration, the GND pin of the converter
can be the single-point-ground in a single point grounding
system. The input signal ground, the reference signal
ground, the digital drivers ground (usually the digital
ground) and the power supply ground (the analog ground)
should be connected in a star configuration with the com-
mon point located as close to the GND pin as possible.
The power supply current during the conversion state
should be kept to a minimum. This is achieved by restrict-
ing the number of digital signal transitions occurring
during this period.
While a digital input signal is in the range 0.5V to
(V
CC
–␣ 0.5V), the CMOS input receiver draws additional
current from the power supply. It should be noted that,
when any one of the digital input signals (F
O
, CS and SCK
in External SCK mode of operation) is within this range, the
LTC2401/LTC2402 power supply current may increase
even if the signal in question is at a valid logic level. For
micropower operation and in order to minimize the poten-
tial errors due to additional ground pin current, it is
recommended to drive all digital input signals to full CMOS
levels [V
IL
< 0.4V and V
OH
> (V
CC
– 0.4V)].
Severe ground pin current disturbances can also occur
due to the undershoot of fast digital input signals. Under-
shoot and overshoot can occur because of the impedance
mismatch at the converter pin when the transition time of
an external control signal is less than twice the propaga-
tion delay from the driver to LTC2401/LTC2402. For
APPLICATIO S I FOR ATIO
WUUU
CAPACITANCE ON CS (pF)
1
0
SUPPLY CURRENT (µA
RMS
)
50
100
150
200
250
300
10 100 1000 10000
24012 F14
100000
V
CC
= 5V
V
CC
= 3V
Figure 14. CS Capacitance vs Supply Current
DIGITAL SIGNAL LEVELS
The LTC2401/LTC2402’s digital interface is easy to use.
Its digital inputs (F
O
, CS and SCK in External SCK mode of
operation) accept standard TTL/CMOS logic levels and the
internal hysteresis receivers can tolerate edge rates as slow
23
LTC2401/LTC2402
reference, on a regular FR-4 board, signal propagation
velocity is approximately 183ps/inch for internal traces
and 170ps/inch for surface traces. Thus, a driver gener-
ating a control signal with a minimum transition time of
1ns must be connected to the converter pin through a
trace shorter than 2.5 inches. This problem becomes
particularly difficult when shared control lines are used
and multiple reflections may occur. The solution is to
carefully terminate all transmission lines close to their
characteristic impedance.
Parallel termination near the LTC2401/LTC2402 pin will
eliminate this problem but will increase the driver power
dissipation. A series resistor between 27 and 56
placed near the driver or near the LTC2401/LTC2402 pin
will also eliminate this problem without additional power
dissipation. The actual resistor value depends upon the
trace impedance and connection topology.
Driving the Input and Reference
The analog input and reference of the typical delta-sigma
analog-to-digital converter are applied to a switched ca-
pacitor network. This network consists of capacitors
switching between the analog input (V
IN
), ZS
SET
(Pin 5)
and FS
SET
(Pin 2). The result is small current spikes seen
at both V
IN
and V
REF
. A simplified input equivalent circuit
is shown in Figure 15.
The key to understanding the effects of this dynamic
input current is based on a simple first order RC time
constant model. Using the internal oscillator, the
LTC2401/LTC2402’s internal switched capacitor network
is clocked at 153,600Hz corresponding to a 6.5µs sam-
pling period. Fourteen time constants are required each
time a capacitor is switched in order to achieve 1ppm
settling accuracy.
Therefore, the equivalent time constant at V
IN
and V
REF
should be less than 6.5µs/14 = 460ns in order to achieve
1ppm accuracy.
Input Current (V
IN
)
If complete settling occurs on the input, conversion results
will be uneffected by the dynamic input current. If the
settling is incomplete, it does not degrade the linearity
performance of the device. It simply results in an offset/
full-scale shift, see Figure 16. To simplify the analysis of
input dynamic current, two separate cases are assumed:
large capacitance at V
IN
(C
IN
> 0.01µF) and small capaci-
tance at V
IN
(C
IN
< 0.01µF).
APPLICATIO S I FOR ATIO
WUUU
FS
SET
CH0/CH1
V
CC
R
SW
5k
AVERAGE INPUT CURRENT:
I
IN
= 0.25(V
IN
– 0.5 • V
REF
)fC
EQ
I
REF(LEAK)
I
REF(LEAK)
V
CC
R
SW
5k
C
EQ
2.5pF (TYP)
R
SW
5k
I
IN(LEAK)
I
IN
24012 F15
I
IN(LEAK)
SWITCHING FREQUENCY
f = 153.6kHz FOR INTERNAL OSCILLATOR (f
O
= LOGIC LOW OR HIGH)
f = f
EOSC
FOR EXTERNAL OSCILLATORS
ZS
SET
Figure 15. LTC2401/LTC2402 Equivalent Analog Input Circuit
ZS
SET
TUE
V
IN
24012 F16
FS
SET
Figure 16. Offset/Full-Scale Shift
If the total capacitance at V
IN
(see Figure 17) is small
(<0.01µF), relatively large external source resistances (up
to 20k for 20pF parasitic capacitance) can be tolerated
without any offset/full-scale error. Figures 18 and 19 show
a family of offset and full-scale error curves for various
small valued input capacitors (C
IN
< 0.01µF) as a function
of input source resistance.
For large input capacitor values (C
IN
> 0.01µF), the input
spikes are averaged by the capacitor into a DC current. The
gain shift becomes a linear function of input source
24
LTC2401/LTC2402
resistance independent of input capacitance, see Figures
20 and 21. The equivalent input impedance is 6.25M.
This results in ±400µA of input dynamic current at the
extreme values of V
IN
(V
IN
= 0V and V
IN
= V
REF
, when
V
REF
= 5V). This corresponds to a 0.8ppm shift in offset
and full-scale readings for every 10 of input source
resistance.
C
IN
24012 F17
INTPUT
SIGNAL
SOURCE
R
SOURCE
V
IN
LTC2401/
LTC2402
C
PAR
20pF
APPLICATIO S I FOR ATIO
WUUU
Figure 17. An RC Network at V
IN
Figure 18. Offset vs R
SOURCE
(Small C)
Figure 19. Offset vs R
SOURCE
(Large C)
In addition to the input current spikes, the input ESD
protection diodes have a temperature dependent leakage
current. This leakage current, nominally 1nA (±10nA
max), results in a fixed offset shift of 10µV for a 10k source
resistance.
The effect of input leakage current is evident for C
IN
= 0 in
Figures 18 and 21. A leakage current of 3nA results in a
150µV (30ppm) error for a 50k source resistance. As
R
SOURCE
gets larger, the switched capacitor input current
begins to dominate.
Reference Current (V
REF
)
Similar to the analog input, the reference input has a
dynamic input current. This current has negligible effect
Figure 20. Full-Scale Error vs R
SOURCE
(Large C)
Figure 21. Full-Scale Error vs R
SOURCE
(Small C)
R
SOURCE
()
1
–10
OFFSET ERROR (ppm)
0
10
20
30
40
50
10 100 1k 10k
24012 F18
100k
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25°C
C
IN
= 100pF
C
IN
= 0.01µF
C
IN
= 1000pF
C
IN
= NO CAP
R
SOURCE
()
0
OFFSET ERROR (ppm)
40
60
800
24012 F19
20
0
200
400
600
1000
80
C
IN
= 22µF
C
IN
= 10µF
C
IN
= 1µF
C
IN
= 0.1µF
C
IN
= 0.01µF
C
IN
= 0.001µF
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25°C
R
SOURCE
()
0
–80
FULL-SCALE ERROR (ppm)
–70
–50
–40
–30
400
800
1000
10
24012 F20
–60
200 600
–20
–10
0
C
IN
= 22µF
C
IN
= 10µF
C
IN
= 1µF
C
IN
= 0.1µF
C
IN
= 0.01µF
C
IN
= 0.001µF
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25°C
R
SOURCE
()
0
FULL-SCALE (ppm)
–10
10
10k
24012 F21
–30
–50
10
100
1k
100k
30
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25°C
C
IN
= NO CAP
C
IN
= 0.01µF
C
IN
= 1000pF
C
IN
= 100pF

LTC2401IMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 24-Bit Power Delta-Sigma ADC
Lifecycle:
New from this manufacturer.
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