LTC3831
18
3831fb
APPLICATIONS INFORMATION
LAYOUT CONSIDERATIONS
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3831. These items are also illustrated graphically
in the layout diagram of Figure 10. The thicker lines show
the high current paths. Note that at 5A current levels or
above, current density in the PC board itself is a serious
concern. Traces carrying high current should be as wide as
possible. For example, a PCB fabricated with
2oz copper
requires a minimum trace width of
0.15” to carry 5A
.
1. In general, layout should begin with the location of the
power devices. Be sure to orient the power circuitry so
that a clean power fl ow path is achieved. Conductor
widths should be maximized and lengths minimized.
After you are satisfi ed with the power path, the control
circuitry should be laid out. It is much easier to fi nd
routes for the relatively small traces in the control cir-
cuits than it is to fi nd circuitous routes for high current
paths.
2.
The GND and PGND pins should be shorted directly at
the LTC3831
. This helps to minimize internal ground
disturbances in the LTC3831 and prevents differences
in ground potential from disrupting internal circuit
operation. This connection should then tie into the
ground plane
at a single point, preferably at a fairly
quiet point in the circuit such as
close to the output
capacitors
. This is not always practical, however, due
to physical constraints. Another reasonably good point
to make this connection is between the output capaci-
tors and the source connection of the bottom MOSFET
Q2. Do not tie this single point ground in the trace run
between the Q2 source and the input capacitor ground,
as this area of the ground plane will be very noisy.
3. The small-signal resistors and capacitors for frequency
compensation and soft-start should be located very close
to their respective pins and the ground ends connected
to the signal ground pin through a separate trace. Do
not connect these parts to the ground plane!
4. The V
CC
, PV
CC1
and PV
CC2
decoupling capacitors should
be as close to the LTC3831 as possible. The 4.7µF and
1µF bypass capacitors shown at V
CC
, PV
CC1
and PV
CC2
will help provide optimum regulation performance.
5. The (+) plate of C
IN
should be connected as close as
possible to the drain of the upper MOSFET, Q1. An ad-
ditional 1µF ceramic capacitor between V
IN
and power
ground is recommended.
6. The V
FB
pin is very sensitive to pickup from the switching
node. Care should be taken to isolate V
FB
from possible
capacitive coupling to the inductor switching signal.
7. In a typical SSTL application, if the R
+
pin is to be con-
nected to V
DDQ
, which is also the main supply voltage
for the switching regulator, do not connect R
+
along the
high current fl ow path; it should be connected to the
SSTL interface supply output. R
–
should be connected
to the interface supply GND.
8. Kelvin sense I
MAX
and I
FB
at Q1’s drain and source
pins.
