©2011 Silicon Storage Technology, Inc. DS25041A 05/11
33
8 Mbit (x16) Multi-Purpose Flash Plus
SST39VF801C / SST39VF802C / SST39LF801C / SST39LF802C
Data Sheet
Microchip Technology Company
Product Ordering Information
SST 39 VF 801C - 70 - 4C - EKE
XX XX XXXX - XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 balls or leads
Q = 48 balls (66 possible positions)
Package Type
E = TSOP (type1, die up, 12mm x 20mm)
B3 = TFBGA (6mm x 8mm, 0.8mm pitch)
MA = WFBGA (4mm x 6mm, 0.5mm pitch)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
70 = 70 ns
55 = 55 ns
Hardware Block Protection
1 = Bottom Boot-Block
2 = Top Boot-Block
Device Density
80= 8 Mbit
Voltage
V = 2.7-3.6V
L = 3.0-3.6V
Product Series
39 = Multi-Purpose Flash
1. Environmental suffix “E” denotes non-Pb solder.
SST non-Pb solder devices are “RoHS Compliant”.