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SST39VF801C-70-4C-B3KE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38
©2011 Silicon Storage Technology, Inc. DS25041A 05/11
34
8 Mbit (x16) Multi-Purpose Flash Plus
SST39VF801C / SST39VF802C / SST39LF801C / SST39LF802C
Data Sheet
A
Microchip Technology Company
Valid Combinations for SST39VF801C
SST39VF801C-70-4C-EKE SST39VF801C-70-4C-B3KE SST39VF801C-70-4C-MAQE
SST39VF801C-70-4I-EKE SST39VF801C-70-4I-B3KE SST39VF801C-70-4I-MAQE
Valid Combinations for SST39VF802C
SST39VF802C-70-4C-EKE SST39VF802C-70-4C-B3KE SST39VF802C-70-4C-MAQE
SST39VF802C-70-4I-EKE SST39VF802C-70-4I-B3KE SST39VF802C-70-4I-MAQE
Valid Combinations for SST39LF801C
SST39LF801C-55-4C-EKE SST39LF801C-55-4C-B3KE SST39LF801C-55-4C-MAQE
Valid Combinations for SST39LF802C
SST39LF802C-55-4C-EKE SST39LF802C-55-4C-B3KE SST39LF802C-55-4C-MAQE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
©2011 Silicon Storage Technology, Inc. DS25041A 05/11
35
8 Mbit (x16) Multi-Purpose Flash Plus
SST39VF801C / SST39VF802C / SST39LF801C / SST39LF802C
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 27:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
SST Package Code: EK
1.05
0.95
0.70
0.50
18.50
18.30
20.20
19.80
0.70
0.50
12.20
11.80
0.27
0.17
0.15
0.05
48-tsop-EK-8
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
0°- 5°
DETAIL
Pin # 1 Identifier
0.50
BSC
©2011 Silicon Storage Technology, Inc. DS25041A 05/11
36
8 Mbit (x16) Multi-Purpose Flash Plus
SST39VF801C / SST39VF802C / SST39LF801C / SST39LF802C
Data Sheet
A
Microchip Technology Company
Figure 28:48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
SST Package Code: B3K
A1 CORNER
HGFEDCBA
ABCDEFGH
BOTTOM VIEWTOP VIEW
SIDE VIEW
6
5
4
3
2
1
6
5
4
3
2
1
SEATING PLANE
0.35 ± 0.05
1.10 ± 0.10
0.12
6.00 ± 0.10
0.45 ± 0.05
(48X)
A1 CORNER
8.00 ± 0.10
0.80
4.00
0.80
5.60
48-tfbga-B3K-6x8-450mic-5
Note: 1. Complies with JEDEC Publication 95, MO-210, variant AB-1 , although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
1mm
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38

SST39VF801C-70-4C-B3KE

Mfr. #:
Buy SST39VF801C-70-4C-B3KE
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7 to 3.6V 8Mbit Multi-Purpose Flash
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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