1N5908, SM5908 Characteristics
Doc ID 2914 Rev 3 5/9
Figure 8. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (SMC)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (DO-201)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead (SMC)
Figure 11. Leakage current versus junction
temperature (typical values)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z
th(j-a)
/R
th(j-a)
t
P
(s)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
Z
th(j-a)
/R
th(j-a)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t
P
(s)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S
CU
(cm²)
PCB FR4, copper thickness = 35 µm
I
R
(A)
1.E+00
1.E+01
1.E+02
25 50 75 100 125 150 175
T
j
(°C)
µ
