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ADG5207BCPZ-RL7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
ADG5206/ADG5207 Data Sheet
Rev. A | Page 10 of 28
CONTINUOUS CURRENT PER CHANNEL, Sx, D, OR Dx
Table 5. ADG5206
Parameter 25°C 60°C 85°C 125°C Unit
CONTINUOUS CURRENT, Sx OR D
V
DD
= +15 V, V
SS
= −15 V
TSSOP (θ
JA
= 67.7°C/W) 44 32 23 12 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 62 42 28 13 mA maximum
V
DD
= +20 V, V
SS
= −20 V
TSSOP (θ
JA
= 67.7°C/W) 47 33 24 12 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 66 44 29 13 mA maximum
V
DD
= 12 V, V
SS
= 0 V
TSSOP (θ
JA
= 67.7°C/W) 31 24 19 11 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 45 33 24 12 mA maximum
V
DD
= 36 V, V
SS
= 0 V
TSSOP (θ
JA
= 67.7°C/W) 46 33 24 12 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 65 43 28 13 mA maximum
Table 6. ADG5207
Parameter 25°C 60°C 85°C 125°C Unit
CONTINUOUS CURRENT, Sx OR Dx
V
DD
= +15 V, V
SS
= −15 V
TSSOP (θ
JA
= 67.7°C/W) 33 25 19 11 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 48 34 24 12 mA maximum
V
DD
= +20 V, V
SS
= −20 V
TSSOP (θ
JA
= 67.7°C/W) 35 27 20 11 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 51 36 25 12 mA maximum
V
DD
= 12 V, V
SS
= 0 V
TSSOP (θ
JA
= 67.7°C/W) 23 19 15 12 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 34 26 20 12 mA maximum
V
DD
= 36 V, V
SS
= 0 V
TSSOP (θ
JA
= 67.7°C/W) 34 26 20 11 mA maximum
LFCSP (θ
JA
= 27.27°C/W) 50 35 25 12 mA maximum
Data Sheet ADG5206/ADG5207
Rev. A | Page 11 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
48 V
V
DD
to GND −0.3 V to +48 V
V
SS
to GND +0.3 V to −48 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, Sx, D, or Dx Pins
ADG5206 140 mA (pulsed at 1 ms, 10%
duty cycle maximum)
ADG5207 105 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, Sx, D, or Dx
Pins
2
Data + 15%
Temperature Range
Operating −40°C to +125°C
Storage −65°C to +150°C
Junction Temperature
150°C
Thermal Impedance, θ
JA
28-Lead TSSOP (4-Layer Board) 67.7°C/W
32-Lead LFCSP (4-Layer Board) 27.27°C/W
Reflow Soldering Peak
Temperature, Pb Free
As per JEDEC J-STD-020
HBM ESD
(ESDA/JEDEC JS-001-2011)
ADG5206
All Pins 8 kV
ADG5207
I/O Port to Supplies 8 kV
I/O Port to I/O Port 2 kV
All Other Pins 8 kV
1
Overvoltages at the Ax, EN, Sx, D, and Dx pins are clamped by internal
diodes. Limit current to the maximum ratings given.
2
See Table 5 and Table 6.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION
ADG5206/ADG5207 Data Sheet
Rev. A | Page 12 of 28
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. ADG5206 Pin Configuration (TSSOP)
Figure 4. ADG5206 Pin Configuration (LFCSP)
Table 8. ADG5206 Pin Function Descriptions
Pin No.
Mnemonic Description
TSSOP LFCSP
1 31 V
DD
Most Positive Power Supply Potential.
2, 3, 13 12, 13, 26, 27,
28, 30, 32
NC No Connect. Not internally connected.
4 1 S16 Source Terminal 16. This pin can be an input or an output.
5 2 S15 Source Terminal 15. This pin can be an input or an output.
6 3 S14 Source Terminal 14. This pin can be an input or an output.
7 4 S13 Source Terminal 13. This pin can be an input or an output.
8 5 S12 Source Terminal 12. This pin can be an input or an output.
9 6 S11 Source Terminal 11. This pin can be an input or an output.
10 7 S10 Source Terminal 10. This pin can be an input or an output.
11 8 S9 Source Terminal 9. This pin can be an input or an output.
12 9 GND Ground (0 V) Reference.
14 10 A3 Logic Control Input.
15 11 A2 Logic Control Input.
16
14
A1
Logic Control Input.
17 15 A0 Logic Control Input.
18 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are turned
off. When this pin is high, the Ax logic inputs determine which switch is turned on.
19 17 S1 Source Terminal 1. This pin can be an input or an output.
20 18 S2 Source Terminal 2. This pin can be an input or an output.
21 19 S3 Source Terminal 3. This pin can be an input or an output.
22 20 S4 Source Terminal 4. This pin can be an input or an output.
23 21 S5 Source Terminal 5. This pin can be an input or an output.
24 22 S6 Source Terminal 6. This pin can be an input or an output.
25 23 S7 Source Terminal 7. This pin can be an input or an output.
26 24 S8 Source Terminal 8. This pin can be an input or an output.
27 25 V
SS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
28 29 D Drain Terminal. This pin can be an input or an output.
NA Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
10714-003
1
V
DD
28
D
2
NC
27
V
SS
3
NC
26
S8
4
S16
25
S7
5
S15
24
S6
6
S14
23
S5
7
S13
22
S4
8
S12
21
S3
9
S11
20
S2
10
S10
19
S1
11
S9
18
EN
12
GND
17
A0
13
NC
16
A1
14
A3
15
A2
ADG5206
TOP VIEW
(Not to Scale)
NOTES
1. NO CONNECT. NOT INTERNALLY CONNECTED.
10714-004
1S16
2S15
3S14
4S13
5S12
6S11
7S10
8S9
24 S8
23 S7
22 S6
21 S5
20 S4
19 S3
18 S2
17 S1
9GND
10A3
11A2
12NC
13NC
14A1
15A0
16EN
32
NC
31
V
DD
30
NC
29
D
28
NC
27
NC
26
NC
25
V
SS
TOP VIEW
(Not to Scale)
ADG5206
NOTES
1. NO CONNECT. NOT INTERNALLY CONNECTED.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE SOLDER JOINTS AND
MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
SS
.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

ADG5207BCPZ-RL7

Mfr. #:
Buy ADG5207BCPZ-RL7
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs +12V +36V 8:1Mux
Lifecycle:
New from this manufacturer.
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