VN800S / VN800PT Package and PCB thermal data
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4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 24. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58mm x 58 mm,PCB
thickness = 2 mm, Cu thickness=35µm , Copper areas: 0.14 cm
2
, 2 cm
2
).
Figure 25. SO-8 R
thj-amb
Vs. PCB copper area in open box free air condition
70
75
80
85
90
95
100
105
110
0 0,5 1 1,5 2 2,5
PCB Cu heatsink area (cm^2)
RTHj_amb
(ºC/W)
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Figure 26. SO-8 thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
where δ = t
P
/T
Figure 27. SO-8 thermal fitting model of a single channel
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZT H (°C /W)
0.5 cm
2
2 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
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Table 12. SO-8 thermal parameters
4.2 PPAK thermal data
Figure 28. PPAK PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 60mm x 60mm, PCB
thickness = 2 mm, Cu thickness=35µm , Copper areas: 0.44 cm
2
, 8 cm
2
).
Area/island (cm
2
)0.142
R1 (°C/W) 0.24
R2 (°C/W) 1.2
R3 (°C/W) 4.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W·s/°C) 0.00015
C2 (W·s/°C) 0.0005
C3 (W·s/°C) 0.0075
C4 (W·s/°C) 0.045
C5 (W·s/°C) 0.35
C6 (W·s/°C) 1.05 2

VN800PT

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers 0.7A 36V High Side
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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