Package and PCB thermal data VN800S / VN800PT
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Figure 29. PPAK R
thj-amb
Vs. PCB copper area in open box free air condition
Figure 30. PPAK thermal impedance junction ambient single pulse
0
10
20
30
40
50
60
70
80
90
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb
C /W)
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZT HC /W)
0.44 cm
2
6 cm
2
VN800S / VN800PT Package and PCB thermal data
23/32
Equation 2: pulse calculation formula
where δ = t
P
/T
Figure 31. PPAK thermal fitting model of a single channel
Table 13. PPAK thermal parameters
Area/island (cm
2
)0.446
R1 (°C/W) 0.04
R2 (°C/W) 0.25
R3 (°C/W) 0.3
R4 (°C/W) 2
R5 (°C/W) 15
R6 (°C/W) 61 24
C1 (W·s/°C) 0.0008
C2 (W·s/°C) 0.007
C3 (W·s/°C) 0.02
C4 (W·s/°C) 0.3
C5 (W·s/°C) 0.45
C6 (W·s/°C) 0.8 5
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
Package and packing information VN800S / VN800PT
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5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.2 SO-8 package information
Figure 32. SO-8 package dimensions

VN800PT

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers 0.7A 36V High Side
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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