IRLR/U3714Z
www.irf.com 7
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET
®
Power MOSFETs
Circuit Layout Considerations
Low Stray Inductance
Ground Plane
Low Leakage Inductance
Current Transformer
P.W.
Period
di/dt
Diode Recovery
dv/dt
Ripple 5%
Body Diode Forward Drop
Re-Applied
Voltage
Reverse
Recovery
Current
Body Diode Forward
Current
V
GS
=10V
V
DD
I
SD
Driver Gate Drive
D.U.T. I
SD
Waveform
D.U.T. V
DS
Waveform
Inductor Curent
D =
P. W .
Period
* V
GS
= 5V for Logic Level Devices
*
+
-
+
+
+
-
-
-
R
G
V
DD
dv/dt controlled by R
G
Driver same type as D.U.T.
I
SD
controlled by Duty Factor "D"
D.U.T. - Device Under Test
D.U.T
Fig 16. Gate Charge Waveform
Vds
Vgs
Id
Vgs(th)
Qgs1
Qgs2 Qgd Qgodr
IRLR/U3714Z
8 www.irf.com
Control FET
Special attention has been given to the power losses
in the switching elements of the circuit - Q1 and Q2.
Power losses in the high side switch Q1, also called
the Control FET, are impacted by the R
ds(on)
of the
MOSFET, but these conduction losses are only about
one half of the total losses.
Power losses in the control switch Q1 are given
by;
P
loss
= P
conduction
+ P
switching
+ P
drive
+ P
output
This can be expanded and approximated by;
P
loss
= I
rms
2
× R
ds(on )
()
+ I ×
Q
gd
i
g
× V
in
× f
+ I ×
Q
gs2
i
g
× V
in
× f
+ Q
g
× V
g
× f
()
+
Q
oss
2
×V
in
× f
This simplified loss equation includes the terms Q
gs2
and Q
oss
which are new to Power MOSFET data sheets.
Q
gs2
is a sub element of traditional gate-source
charge that is included in all MOSFET data sheets.
The importance of splitting this gate-source charge
into two sub elements, Q
gs1
and Q
gs2
, can be seen from
Fig 16.
Q
gs2
indicates the charge that must be supplied by
the gate driver between the time that the threshold
voltage has been reached and the time the drain cur-
rent rises to I
dmax
at which time the drain voltage be-
gins to change. Minimizing Q
gs2
is a critical factor in
reducing switching losses in Q1.
Q
oss
is the charge that must be supplied to the out-
put capacitance of the MOSFET during every switch-
ing cycle. Figure A shows how Q
oss
is formed by the
parallel combination of the voltage dependant (non-
linear) capacitances C
ds
and C
dg
when multiplied by
the power supply input buss voltage.
Synchronous FET
The power loss equation for Q2 is approximated
by;
P
loss
= P
conduction
+ P
drive
+ P
output
*
P
loss
= I
rms
2
× R
ds(on)()
+ Q
g
× V
g
× f
()
+
Q
oss
2
×V
in
× f
+ Q
rr
× V
in
× f
(
)
*dissipated primarily in Q1.
For the synchronous MOSFET Q2, R
ds(on)
is an im-
portant characteristic; however, once again the im-
portance of gate charge must not be overlooked since
it impacts three critical areas. Under light load the
MOSFET must still be turned on and off by the con-
trol IC so the gate drive losses become much more
significant. Secondly, the output charge Q
oss
and re-
verse recovery charge Q
rr
both generate losses that
are transfered to Q1 and increase the dissipation in
that device. Thirdly, gate charge will impact the
MOSFETs’ susceptibility to Cdv/dt turn on.
The drain of Q2 is connected to the switching node
of the converter and therefore sees transitions be-
tween ground and V
in
. As Q1 turns on and off there is
a rate of change of drain voltage dV/dt which is ca-
pacitively coupled to the gate of Q2 and can induce
a voltage spike on the gate that is sufficient to turn
the MOSFET on, resulting in shoot-through current .
The ratio of Q
gd
/Q
gs1
must be minimized to reduce the
potential for Cdv/dt turn on.
Power MOSFET Selection for Non-Isolated DC/DC Converters
Figure A: Q
oss
Characteristic
IRLR/U3714Z
www.irf.com 9
D-Pak (TO-252AA) Package Outline
Dimensions are shown in millimeters (inches)
D-Pak (TO-252AA) Part Marking Information
6.73 (.265)
6.35 (.250)
- A -
4
1 2 3
6.22 (.245)
5.97 (.235)
- B -
3X
0.89 (.035)
0.64 (.025)
0.25 (.010) M A M B
4.57 (.180)
2.28 (.090)
2X
1.14 (.045)
0.76 (.030)
1.52 (.060)
1.15 (.045)
1.02 (.040)
1.64 (.025)
5.46 (.215)
5.21 (.205)
1.27 (.050)
0.88 (.035)
2.38 (.094)
2.19 (.086)
1.14 (.045)
0.89 (.035)
0.58 (.023)
0.46 (.018)
6.45 (.245)
5.68 (.224)
0.51 (.020)
MIN.
0.58 (.023)
0.46 (.018)
LEAD ASSIGNMENTS
1 - GATE
2 - DRAIN
3 - SOURCE
4 - DRAIN
10.42 (.410)
9.40 (.370)
NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE TO-252AA.
4 DIMENSIONS SHOWN ARE BEFORE SOLDER DIP,
SOLDER DIP MAX. +0.16 (.006).
EXAMPLE:
LOT CODE 9U1P
T HIS IS AN IRFR120
WITH ASSEMBLY
WE E K = 16
DAT E CODE
YEAR = 0
LOGO
RECTIFIER
INT E RNATIONAL
AS S E MB L Y
LOT CODE
016
IRF U120
9U 1P
Notes : T his part marking information applies to devices produced before 02/26/2001
INT E RNATIONAL
LOGO
RECTIFIER
3412
IRF U120
916A
LOT CODE
AS S E MB L Y
EXAMPLE:
WITH ASSEMBLY
T HIS IS AN IRFR120
YE AR 9 = 1999
DAT E CODE
LINE A
WE E K 16
IN THE ASSEMBLY LINE "A"
ASSEMBLED ON WW 16, 1999
L OT CODE 1234
PART NUMBER
Notes : T his part marking information applies to devices produced after 02/26/2001

IRLR3714Z

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 20V 37A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
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