MC100EP195B
http://onsemi.com
10
Table 10. AC CHARACTERISTICS V
CC
= 0 V; V
EE
= −3.0 V to −3.6 V or V
CC
= 3.0 V to 3.6 V; V
EE
= 0 V (Note 14)
Symbo
l
Characteristic
−40°C 25°C 85°C
Uni
t
Min Typ Max Min Typ Max Min Typ Max
f
max
Maximum Frequency 1.2 1.2 1.2 GHz
V
outPP
Output Voltage Amplitude 610 820 610 820 610 820 mV
t
PLH
t
PHL
Propagation Delay
IN to Q; D(0−10) = 0, SETMIN
IN to Q; D(0−10) = 1023, SETMAX
EN
to Q; D(0−10) = 0
D0 to CASCADE
2000
10900
1990
375
2400
12400
2500
475
2800
13900
2990
575
2150
11500
2130
400
2500
13000
2600
500
2950
14500
3130
600
2250
12250
2380
425
2700
13750
2800
525
3050
15250
3380
625
ps
t
RANGE
Programmable Range
t
PD
(max) − t
PD
(min) 8950 9950 10950 9450 10450 11450 10110 11100 12110
ps
Dt
Step Delay (Note 15)
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
D7 High
D8 High
D9 High
10
16
32
65
155
310
620
1200
2500
4900
11
18
33
72
165
325
650
1300
2600
5200
15
26
46
92
195
370
720
1400
2800
5500
ps
NLIN Non−Linearity (Note 21)
0 to 511 Decimal Values for
D[9:0] Range
512 to 1024 Decimal Values for
D[9:0] Range
1 to 1023 Decimal Values for
D[9:0] Range
$7.0
$7.0
$11
$7.0
$7.0
$11
$11
$11
$18
ps
t
SKEW
Duty Cycle Skew (Note 16)
|t
PHL
−t
PLH
| 25 90 25 90 25 90
ps
t
s
Setup Time
D to LEN
D to IN (Note 17)
EN
to IN (Note 18)
200
500
300
−40
−550
100
200
500
300
−40
−590
100
200
500
300
−40
−650
120
ps
t
h
Hold Time
LEN to D
IN to EN
(Note 19)
200
400
50
−320
200
400
40
−350
200
400
30
−400
ps
t
R
Release Time
EN
to IN (Note 20)
SET MAX to LEN
SET MIN to LEN
300
400
350
−150
180
220
300
400
350
−170
200
250
300
400
350
−200
210
260
ps
t
jitter
RMS Random Clock Jitter @ 1.2 GHz
IN to Q; D(0:10) = 0 or SETMIN
IN to Q; D(0:10) = 1023 or SETMAX
0.9
1.9
2.0
5.0
1.1
2.6
2.0
5.0
1.2
3.3
2.0
5.0
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
14.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
CC
− 2.0 V.
15.Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations
of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
16.Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
17.This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
18.This setup time is the minimum time that EN
must be asserted prior to the next transition of IN/IN to prevent an output response greater
than ±75 mV to that IN/IN
transition.
19.This hold time is the minimum time that EN
must remain asserted after a negative going IN or positive going IN to prevent an output re-
sponse greater than ±75 mV to that IN/IN transition.
20.This release time is the minimum time that EN
must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and transition times.
21.Deviation from a linear delay (actual Min to Max) in the 1024 programmable steps.
MC100EP195B
http://onsemi.com
11
Table 10. AC CHARACTERISTICS V
CC
= 0 V; V
EE
= −3.0 V to −3.6 V or V
CC
= 3.0 V to 3.6 V; V
EE
= 0 V (Note 14)
Symbol Unit
85°C25°C−40°C
Characteristic
Symbol Unit
MaxTypMinMaxTypMinMaxTypMin
Characteristic
V
PP
Input Voltage Swing
(Differential Configuration)
150 800 1200 150 800 1200 150 800 1200 mV
t
r
t
f
Output Rise/Fall Time @ 50 MHz
20−80% (Q)
20−80% (CASCADE)
85
110
115
160
140
210
100
120
120
175
140
230
100
120
130
190
165
250
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
14.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
CC
− 2.0 V.
15.Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations
of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
16.Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
17.This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
18.This setup time is the minimum time that EN
must be asserted prior to the next transition of IN/IN to prevent an output response greater
than ±75 mV to that IN/IN
transition.
19.This hold time is the minimum time that EN
must remain asserted after a negative going IN or positive going IN to prevent an output re-
sponse greater than ±75 mV to that IN/IN transition.
20.This release time is the minimum time that EN
must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and transition times.
21.Deviation from a linear delay (actual Min to Max) in the 1024 programmable steps.
Figure 4. AC Reference Measurement
IN
IN
Q
Q
t
PHL
t
PLH
V
INPP
= V
IH
(D) − V
IL
(D)
V
OUTPP
= V
OH
(Q) − V
OL
(Q)
Cascading Multiple EP195Bs
To increase the programmable range of the EP195B,
internal cascade circuitry has been included. This circuitry
allows for the cascading of multiple EP195Bs without the
need for any external gating. Furthermore, this capability
requires only one more address line per added E195B.
Obviously, cascading multiple programmable delay chips
will result in a larger programmable range: however, this
increase is at the expense of a longer minimum delay.
Figure 5 illustrates the interconnect scheme for cascading
two EP195Bs. As can be seen, this scheme can easily be
expanded for larger EP195B chains. The D10 input of the
EP195B is the CASCADE control pin. With the
interconnect scheme of Figure 5 when D10 is asserted, it
signals the need for a larger programmable range than is
achievable with a single device and switches output pin
CASCADE HIGH and pin CASCADE
LOW. The A11
address can be added to generate a cascade output for the
next EP195B. For a 2−device configuration, A11 is not
required.
MC100EP195B
http://onsemi.com
12
V
EE
D0
V
CC
Q
Q
NC
V
CC
V
CC
CASCADE
EN
SETMAX
V
CC
V
EE
LEN
D2 D1
CASCADE
SETMIN
V
BB
IN
V
EE
D8
V
EF
D3D4D5D6D7
D9
D10
IN
V
CF
INPUT
OUTPU
T
V
EE
D0
V
CC
Q
Q
NC
V
CC
V
CC
CASCADE
EN
SETMAX
V
CC
V
EE
LEN
D2 D1
CASCADE
SETMIN
V
BB
IN
V
EE
D8
V
EF
D3D4D5D6D7
D9
D10
IN
V
CF
EP195B
CHIP #2
EP195B
CHIP #1
ADDRESS BUS
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Need if Chip #3 is used
Figure 5. Cascading Interconnect Architecture
An expansion of the latch section of the block diagram is
pictured in Figure 6. Use of this diagram will simplify the
explanation of how the cascade circuitry works. When D10
of chip #1 in Figure 5 is LOW this device’s
CASCADE output will also be low while the CASCADE
output will be high. In this condition the SET MIN pin of
chip #2 will be asserted HIGH and thus all of the latches of
chip #2 will be reset and the device will be set at its minimum
delay.
Chip #1, on the other hand, will have both SET MIN and
SET MAX deasserted so that its delay will be controlled
entirely by the address bus A0—A9. If the delay needed is
greater than can be achieved with 1023 gate delays
(1111111111 on the A0—A9 address bus) D10 will be
asserted to signal the need to cascade the delay to the next
EP195B device. When D10 is asserted, the SET MIN pin of
chip #2 will be deasserted and SET MAX pin asserted
resulting in the device delay to be the maximum delay.
Table 11 shows the delay time of two EP195B chips in
cascade.
To expand this cascading scheme to more devices, one
simply needs to connect the D10 pin from the next chip to
the address bus and CASCADE outputs to the next chip in
the same manner as pictured in Figure 5. The only addition
to the logic is the increase of one line to the address bus for
cascade control of the second programmable delay chip.
SET
MIN
SET
MAX
TO SELECT MULTIPLEXERS
BIT 0
D0 Q0
LEN
Set Reset
BIT 1
D1 Q1
LEN
Set Reset
BIT 2
D2 Q2
LEN
Set Reset
BIT 3
D3 Q3
LEN
Set Reset
BIT 4
D4 Q4
LEN
Set Reset
BIT 5
D5 Q5
LEN
Set Reset
BIT 6
D6 Q6
LEN
Set Reset
BIT 7
D7 Q7
LEN
Set Reset
BIT 8
D8 Q8
LEN
Set Reset
BIT 9
D9 Q9
LEN
Set Reset
Figure 6. Expansion of the Latch Section of the EP195B Block Diagram

MC100EP195BMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Delay Lines / Timing Elements PROGR DELAY CHIP
Lifecycle:
New from this manufacturer.
Delivery:
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