RT8230A/B/C/D/E
19
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Diode Emulation Mode
In diode emulation mode, the RT8230A/B/C/D/E
automatically reduces switching frequency at light load
conditions to maintain high efficiency. This reduction of
frequency is achieved smoothly. As the output current
decreases from heavy load condition, the inductor current
is also reduced, and eventually comes to the point that
its current valley touches zero, which is the boundary
between continuous conduction and discontinuous
conduction modes. To emulate the behavior of diodes,
the low-side MOSFET allows only partial negative current
to flow when the inductor free wheeling current becomes
negative. As the load current is further decreased, it takes
longer and longer time to discharge the output capacitor
to the level that requires the next ON cycle. The on-
time is kept the same as that in the heavy load condition.
In reverse, when the output current increases from light
load to heavy load, the switching frequency increases to
the preset value as the inductor current reaches the
continuous conduction. The transition load point to the
light load operation is shown in Figure 1. and can be
calculated as follows :
Part Number RT8230A RT8230B/E RT8230C/D
Pin Name ENM SECFB SECFB
Pin-13 Voltage Range Mode State
4.5V to 5V ASM ASM ASM
2.3V to 3.6V DEM DEM DEM
1.2V to 1.8V
CH1 : ASM
CH2 : DEM
CH1 : ASM
CH2 : DEM
CH1 : DEM
CH2 : ASM
Below 0.8V Shutdown -- --
Table 1. Operation Mode Setting
Figure 1. Boundary Condition of CCM/DEM
IN OUT
LOAD(SKIP) ON
(V V )
It
2L

where t
ON
is the on-time.
The switching waveforms may appear noisy and
asynchronous when light load causes diode emulation
operation. This is normal and results in high efficiency.
Trade offs in PFM noise vs. light load efficiency is made
by varying the inductor value. Generally, low inductor values
produce a broader efficiency vs. load curve, while higher
values result in higher full load efficiency (assuming that
the coil resistance remains fixed) and less output voltage
ripple. Penalties for using higher inductor values include
larger physical size and degraded load transient response
(especially at low input voltage levels).
In diode emulation mode, the FB voltage will rise to 2.015V
(typ.) naturally, because of the design circuit.
Ultrasonic Mode (ASM)
The RT8230A/B/C/D/E activates a unique type of diode
emulation mode with a minimum switching frequency of
25kHz, called ultrasonic mode. This mode eliminates
audio-frequency modulation that would otherwise be
present when a lightly loaded controller automatically
skips pulses. In ultrasonic mode, the low-side switch gate
driver signal is ORed with an internal oscillator
(>25kHz). Once the internal oscillator is triggered, the
controller will turn on UGATE and give it shorter on-time.
When the on-time expired, LGATE turns on until the
inductor current goes to zero crossing threshold and keep
both high-side and low-side MOSFET off to wait for the
next trigger. Because shorter on-time causes a smaller
pulse of the inductor current, the controller can keep output
I
L
t
0
t
ON
Slope = (V
IN
- V
OUT
) / L
I
PEAK
I
LOAD =
I
PEAK
/ 2
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voltage and switching frequency simultaneously. The on-
time decreasing has a limitation and the output voltage
will be lifted up under the slight load condition. The
controller will turn on LGATE first to pull down the output
voltage. When the output voltage is pulled down to the
balance point of the output load current, the controller will
proceed the short on-time sequence as the above
description.
Linear Regulators (LDOx)
The RT8230A/B/C/D/E includes 5V (LDO5) and 3.3V
(LDO3) linear regulators. The regulators can supply up to
100mA for external loads. Bypass LDOx with a minimum
4.7μF ceramic capacitor. When V
OUT1
is higher than the
switch over threshold (4.66V), an internal 1.5Ω P-MOSFET
switch connects BYP1 to the LDO5 pin while
simultaneously disconnects the internal linear regulator.
Current Limit Setting (ENTRIPx)
The RT8230A/B/C/D/E has cycle-by-cycle current limit
control. The current limit circuit employs a unique valley
current sensing algorithm. If the magnitude of the current
sense signal at PHASEx is above the current limit
threshold, the PWM is not allowed to initiate a new cycle
(Figure 2). The actual peak current is greater than the
current limit threshold by an amount equal to the inductor
ripple current. Therefore, the exact current limit
characteristic and maximum load capability are a function
of the sense resistance, inductor value, battery and output
voltage.
Figure 2. Valley Current Limit
The RT8230A/B/C/D/E uses the on resistance of the
synchronous rectifier as the current sense element and
supports temperature compensated MOSFET R
DS(ON)
sensing. The R
ILIM
resistor between the ENTRIPx pin and
GND sets the current limit threshold. The resistor R
ILIM
is
connected to a current source from ENTRIPx
which is
5μA (typ.) at room temperature. The current source has a
4700ppm/°C temperature slope to compensate the
temperature dependency of the R
DS(ON)
. When the voltage
drop across the sense resistor or low-side MOSFET
equals 1/10 the voltage across the R
ILIM
resistor, positive
current limit will be activated. The high-side MOSFET will
not be turned on until the voltage drop across the MOSFET
falls below 1/10 the voltage across the R
ILIM
resistor.
Choose a current limit resistor according to the following
equation :
V
LIMIT
= (R
LIMIT
x 5μA) / 10 = I
LIMIT
x R
DS(ON)
R
LIMIT
= (I
LIMIT
x R
DS(ON)
) x 10 / 5μA
Carefully observe the PC board layout guidelines to ensure
that noise and DC errors do not corrupt the current sense
signal at PHASEx and GND. Mount or place the IC close
to the low-side MOSFET.
Charge Pump (SECFB)
The external 14V charge pump is driven by LGATEx
(LGATE1 for RT8230B/E, LGATE2 for RT8230C/D). As
shown in Figure 3, when LGATEx is low, C1 will be charged
by V
OUT1
through D1. C1 voltage is equal to V
OUT1
minus
the diode drop. When LGATEx becomes high, C1 transfers
the charge to C2 through D2 and charges C2 voltage to
V
LGATEX
plus C1 voltage. As LGATEx transitions low on
the next cycle, C3 is charged to C2 voltage minus a diode
drop through D3. Finally, C3 charges C4 through D4 when
LGATEx switches high. Thus, the total charge pump
voltage, V
CP
, is :
V
CP
= V
OUT1
+ 2 x V
LGATEx
4 x V
D
where V
LGATEx
is the peak voltage of the LGATEx driver
which is equal to LDO5 and V
D
is the forward voltage
dropped across the Schottky diode.
The SECFB pin in the RT8230B/C/D/E is used to monitor
the charge pump via a resistive voltage divider to generate
approximately 14V DC voltage and the clock driver uses
V
OUT1
as its power supply. In the Figure 3 when SECFB
drops below its feedback threshold, an ultrasonic pulse
will occur to refresh the charge pump driven by LGATEx.
If there is an overload on the charge pump in which SECFB
can not reach more than its feedback threshold, the
I
L
t
I
PEAK
I
LOAD
I
LIMIT
RT8230A/B/C/D/E
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Figure 4. Increasing the UGATEx Rise Time
Soft-Start
The RT8230A/B/C/D/E provides an internal soft-start
function to prevent large inrush current and output voltage
overshoot when the converter starts up. The soft-start (SS)
automatically begins once the chip is enabled. During soft-
start, it clamps the ramping of internal reference voltage
which is compared with FBx signal. The typical soft-start
duration is 0.8ms. A unique PWM duty limit control that
prevents output over-voltage during soft-start period is
designed specifically for FBx floating.
UVLO Protection
The RT8230A/B/C/D/E has LDO5 under-voltage lock out
protection (UVLO). When the LDO5 voltage is lower than
3.9V (typ.) and the LDO3 voltage is lower than 2.5V (typ.),
both switch power supplies are shut off. This is a non-
latch protection.
Power Good Output (PGOOD)
PGOOD is an open-drain output and requires a pull-up
resistor. PGOOD is actively held low in soft-start, standby,
and shutdown. It is released when both output voltages
are above 90% of the nominal regulation point for RT8230A.
For RT8230B/C/D/E, PGOOD is released when both output
voltages are above 92.5% of nominal regulation point, and
the SECFB threshold is also above 50% of nominal
regulation point. The PGOOD signal goes low if either
output turns off or is 15.5% below or 13% over its nominal
regulation point.
Output Over-Voltage Protection (OVP)
The output voltage can be continuously monitored for over-
voltage condition. If the output voltage exceeds 13% of
its set voltage threshold, the over-voltage protection is
triggered and the LGATEx low-side gate drivers are forced
high. This activates the low-side MOSFET switch, which
rapidly discharges the output capacitor and pulls the output
voltage downward. In addition, the BYP1 pin also has the
OVP function.
When detect BYP1 Voltage over 6V, RT8230A/B/C/D/E
will active OVP function immediately.
Figure 3. Charge Pump Circuit Connected to SECFB
MOSFET Gate Driver (UGATEx, LGATEx)
The high-side driver is designed to drive high current, low
R
DS(ON)
N-MOSFET(s). When configured as a floating driver,
5V bias voltage is delivered from the LDO5 supply. The
average drive current is also calculated by the gate charge
at V
GS
= 5V times switching frequency. The instantaneous
drive current is supplied by the flying capacitor between
the BOOTx and PHASEx pins. A dead-time to prevent
shoot through is internally generated from high-side
MOSFET off to low-side MOSFET on and low-side
MOSFET off to high-side MOSFET on.
The low-side driver is designed to drive high current low
R
DS(ON)
N-MOSFET(s). The internal pull down transistor
that drives LGATEx low is robust, with a 1Ω typical on-
resistance. A 5V bias voltage is delivered from the LDO5
supply. The instantaneous drive current is supplied by an
input capacitor connected between LDO5 and GND.
For high current applications, some combinations of high
and low-side MOSFETs may cause excessive gate drain
coupling, which leads to efficiency killing, EMI producing,
and shoot through currents. This is often remedied by
adding a resistor in series with BOOTx, which increases
the turn-on time of the high-side MOSFET without
degrading the turn-off time. See Figure 4.
SECFB
LGATEx
VOUT1
D1 D2 D3
C3
D4
C1
C2
R
CP1
C4
R
CP2
Charge Pump
channel x controller will enter ultrasonic mode. Special
care should be taken to ensure that enough normal ripple
voltage is present on each cycle to prevent charge pump
shutdown.
BOOTx
R
BOOT
UGATEx
V
IN
PHASEx

RT8230AGQW

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IC REG QD BUCK/LNR SYNC 20WQFN
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