OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

IX2127G

P1-P3P4-P6P7-P9P10-P12P13-P13
I
NTEGRATED
C
IRCUITS
D
IVISION
IX2127
10 www.ixysic.com R03
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Output Voltage (mV)
-10
0
10
20
30
40
50
60
70
80
90
100
High-Level Output Voltage V
OH
(V
B
-V
HO
)
vs. Temperature
V
BIAS
Voltage (V)
10.0 10.5 11.0 11.5 12.0
Output Source Current (mA)
Output Source Current vs. Voltage
(V
CC
=V
BS
=V
BIAS
, V
IN
=5V, PW≤10μs)
0
50
100
150
200
250
300
Ref. Fig. 1: R
GATE
=20Ω
V
BIAS
Voltage (V)
10.0 10.5 11.0 11.5 12.0
Output Sink Current (mA)
Output Sink Current
vs. V Bias Voltage
(V
CC
=V
BS
=V
BIAS
, V
IN
=0V, PW≤10μs)
0
100
200
300
400
500
600
Ref. Fig. 1: R
GATE
=20Ω
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Output Voltage (mV)
-10
0
10
20
30
40
50
60
70
80
90
100
Low-Level Output Voltage V
OL
vs. Temperature
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Output Source Current (mA)
0
50
100
150
200
250
300
350
Output Source Current
vs. Temperature
(V
CC
=V
BS
=12V, V
IN
=5V, PW≤10μs)
Ref. Fig. 1: R
GATE
=20Ω
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Output Sink Current (mA)
Output Sink Current
vs. Temperature
(V
CC
=V
BS
=12V, V
IN
=0V, PW≤10μs)
Ref. Fig. 1: R
GATE
=20Ω
0
100
200
300
400
500
600
Input Voltage (V)
9.0 9.5 10.0 10.5 11.0 11.5 12.0
Delay (ns)
Start-Up Blanking Delay
vs. Input Voltage
0
100
200
300
400
500
600
700
Input Voltage (V)
9.0 9.5 10.0 10.5 11.0 11.5 12.0
Delay (nS)
CS Shutdown Propagation Delay
vs. Input Voltage
0
50
100
150
200
250
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Delay (ns)
0
100
200
300
400
500
600
700
800
Start-Up Blanking Delay
vs. Temperature
(V
CC
=V
BS
=12V)
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Delay (ns)
0
50
100
150
200
250
300
CS Shutdown Propogation Delay
vs. Temperature
Temperature (ºC)
-50 -25 0 25 50 75 100 125
Delay (ns)
0
50
100
150
200
250
300
350
CS to FLT Propagation Delay
vs. Temperature
(V
CC
=V
BS
=12V)
I
NTEGRATED
C
IRCUITS
D
IVISION
IX2127
R03 www.ixysic.com 11
3 Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
IX2127G / IX2127N MSL 1
Device Maximum Temperature x Time
IX2127G 250°C for 30 seconds
IX2127N 260°C for 30 seconds
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
IX2127
12 www.ixysic.com R03
3.5 Mechanical Dimensions
3.5.1 8-Pin DIP Through-Hole Package
3.5.2 8-Pin SOIC Package
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
Pin 1
Pin 8
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.270 REF
(0.050)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
0.559 ± 0.254
(0.022 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
P1-P3P4-P6P7-P9P10-P12P13-P13

IX2127G

Mfr. #:
Buy IX2127G
Manufacturer:
IXYS Integrated Circuits
Description:
Gate Drivers High-Voltage MOSFET 600V, 250/500mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet