NTB90N02T4

NTB90N02, NTP90N02
http://onsemi.com
4
10
20
30
40
50
60
70
90
0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
−8 −6 −4 −2
0 2 4 6 8 1012141618202224
V
GS
V
DS
4
8
6
0
10
2000
C, CAPACITANCE (pF)
0
Q
g
, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation Figure 8. Gate−to−Source and
Drain−to−Source Voltage versus Total Charge
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
1
1000
100
1
10 100
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
R
G
, GATE RESISTANCE ()
Figure 10. Diode Forward Voltage versus
Current
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
I
S
, SOURCE CURRENT (AMPS)
t, TIME (ns)
5000
010
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (V)
1000
4000
2
I
D
= 1.0 A
T
J
= 25°C
Q
2
Q
1
V
GS
Q
T
V
DD
= 20 V
I
D
= 20 A
V
GS
= 10 V
t
r
t
d(off)
t
d(on)
t
f
V
GS
= 0 V
T
J
= 25°C
C
rss
C
iss
C
oss
20 30 40 50
V
D
8
24
16
0
28
4
−V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
12
20
3000
10
80
0
V
GS
= 0 V
T
J
= 25°C
ORDERING INFORMATION
Device Package Shipping
NTP90N02 TO−220AB 50 Units / Rail
NTP90N02G TO−220AB
(Pb−Free)
50 Units / Rail
NTB90N02 D
2
PAK 50 Units / Rail
NTB90N02G D
2
PAK
(Pb−Free)
50 Units / Rail
NTB90N02T4 D
2
PAK 800 Tape & Reel
NTB90N02T4G D
2
PAK
(Pb−Free)
800 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NTB90N02, NTP90N02
http://onsemi.com
5
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge
controlled. The lengths of various switching intervals (t)
are determined by how fast the FET input capacitance can
be charged by current from the generator.
The published capacitance data is difficult to use for
calculating rise and fall because drain−gate capacitance
varies greatly with applied voltage. Accordingly, gate
charge data is used. In most cases, a satisfactory estimate of
average input current (I
G(AV)
) can be made from a
rudimentary analysis of the drive circuit so that
t QI
G(AV)
During the rise and fall time interval when switching a
resistive load, V
GS
remains virtually constant at a level
known as the plateau voltage, V
SGP
. Therefore, rise and fall
times may be approximated by the following:
t
r
Q
2
R
2
10(V
GG
V
GSP
)
t
f
Q
2
R
2
V
GSP
where:
V
GG
= the gate drive voltage, which varies from
zero to V
GG
R
G
= the gate drive resistance and Q
2
and V
GSP
are read from the gate charge curve.
During the turn−on and turn−off delay times, gate current
is not constant. The simplest calculation uses appropriate
values from the capacitance curves in a standard equation for
voltage change in an RC network.
The equations are:
t
d(off)
R
G
C
iss
In (V
GG
V
GSP
)
t
d(on)
R
G
C
iss
In [V
GG
(V
GG
V
GSP
)]
The capacitance (C
iss
) is read from the capacitance curve
at a voltage corresponding to the off−state condition when
calculating t
d(on)
and is read at a voltage corresponding to the
on−state when calculating t
d(off)
.
At high switching speeds, parasitic circuit elements
complicate the analysis. The inductance of the MOSFET
source lead, inside the package and in the circuit wiring
which is common to both the drain and gate current paths,
produces a voltage at the source which reduces the gate drive
current. The voltage is determined by Ldi/dt, but since di/dt
is a function of drain current, the mathematical solution is
complex. The MOSFET output capacitance also
complicates the mathematics. And finally, MOSFETs have
finite internal gate resistance which effectively adds to the
resistance of the driving source, but the internal resistance
is difficult to measure and, consequently, is not specified.
The resistive switching time variation versus gate
resistance (Figure 9) shows how typical switching
performance is affected by the parasitic circuit elements. If
the parasitics were not present, the slope of the curves would
maintain a value of unity regardless of the switching speed.
The circuit used to obtain the data is constructed to minimize
common inductance in the drain and gate circuit loops and
is believed readily achievable with board mounted
components. Most power electronic loads are inductive; the
data in the figure is taken with a resistive load, which
approximates an optimally snubbed inductive load. Power
MOSFETs may be safely operated into an inductive load;
however, snubbing reduces switching losses.
NTB90N02, NTP90N02
http://onsemi.com
6
PACKAGE DIMENSIONS
D
2
PAK
CASE 418AA−01
ISSUE O
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
C 0.160 0.190 4.06 4.83
D 0.020 0.036 0.51 0.92
E 0.045 0.055 1.14 1.40
G 0.100 BSC 2.54 BSC
J 0.018 0.025 0.46 0.64
K 0.090 0.110 2.29 2.79
S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
F 0.310 −−− 7.87 −−−
M 0.280 −−− 7.11 −−−
M
F
M
F
M
F
VARIABLE
CONFIGURATION
ZONE
U
VIEW W−W VIEW W−W VIEW W−W
123
8.38
0.33
1.016
0.04
17.02
0.67
10.66
0.42
3.05
0.12
5.08
0.20
mm
inches
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

NTB90N02T4

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET 28V 90A N-Channel
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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