FOD819 Series
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7
Reflow Profile
Figure 17. Reflow Profile
Table 6.
Profile Freature
Pb−Free Assembly Profile
Temperature Min. (Tsmin) 150°C
Temperature Max. (Tsmax) 200°C
Time (t
S
) from (Tsmin to Tsmax) 60–120 seconds
Ramp−up Rate (t
L
to t
P
) 3°C/second max.
Liquidous Temperature (T
L
) 217°C
Time (t
L
) Maintained Above (T
L
) 60–150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (t
P
) within 5°C of 260°C 30 seconds
Ramp−down Rate (T
P
to T
L
) 6°C / second max.
Time 25°C to Peak Temperature 8 minutes max.
Table 7. ORDERING INFORMATION
Part Number
Package Packing Method †
FOD819 DIP 4−Pin Tube (100 units per tube)
FOD819S SMT 4−Pin (Lead Bend) Tube (100 units per tube)
FOD819SD SMT 4−Pin (Lead Bend) Tape and Reel (1,000 units per reel)
FOD819300 DIP 4−Pin, DIN EN/IEC60747−5−5 option Tube (100 units per tube)
FOD8193S SMT 4−Pin (Lead Bend), DIN EN/IEC60747−5−5 option Tube (100 units per tube)
FOD8193SD SMT 4−Pin (Lead Bend), DIN EN/IEC60747−5−5 option Tape and Reel (1,000 units per reel)
FOD819300W DIP 4−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 option Tube (100 units per tube)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
