4/5
PKC-136
0
10
20
30
40
50
60
70
80
90
100
110
012345678910
S(cm²)
Lleads=10mm
Rth(j-a)
Fig. 5: Thermal resistance junction to ambient
versus copper surface under each lead.
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
VR(V)
Tj=100°C
Tj=125°C
Tj=25°C
Tj=150°C
IR(µA)
Fig. 6-1: Reverse leakage current versus reverse
voltage applied (typical values, for Transil).
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 50 100 150 200 250 300 350 400 450 500 550 600 650 700
VR(V)
Tj=100°C
Tj=125°C
Tj=25°C
Tj=150°C
IR(µA)
Fig. 6-2: Reverse leakage current versus reverse
voltage applied (typical values, for diode).
0
5
10
15
20
25
30
35
40
45
50
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
IF=3A
Tj=125°C
V (V)
FP
Fig. 7: Transient peak forward voltage versus
d
IF
/dt (90% confidence).
0.1
1.0
10.0
160 165 170 175 180 185 190 195 200 205 210 215 220
Vcl(V)
tp<500ns
Tj=25°C
Tj=125°C
Ipp(A)
Fig. 8: Clamping voltage versus peak pulse
current (maximum values).
10
100
1 10 100 1000
VR(V)
F=1MHz
Vosc=30mV
RMS
Tj=25°C
C(pF)
Fig. 9: Junction capacitance versus reverse
voltage applied on clamping characteristic (typical
values).
