NTMD4840NR2G

© Semiconductor Components Industries, LLC, 2009
September, 2009 Rev. 1
1 Publication Order Number:
NTMD4840N/D
NTMD4840N
Power MOSFET
30 V, 7.5 A, Dual NChannel, SOIC8
Features
Low R
DS(on)
to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Dual SOIC8 Surface Mount Package Saves Board Space
This is a PbFree Device
Applications
Disk Drives
DCDC Converters
Printers
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Rating
Symbol Value Unit
DraintoSource Voltage V
DSS
30 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JA
(Note 1)
Steady
State
T
A
= 25°C
I
D
5.5
A
T
A
= 70°C 4.4
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
1.14 W
Continuous Drain
Current R
q
JA
(Note 2)
T
A
= 25°C
I
D
4.5
A
T
A
= 70°C 3.5
Power Dissipation
R
q
JA
(Note 2)
T
A
= 25°C P
D
0.68 W
Continuous Drain
Current R
q
JA
t < 10 s
(Note 1)
T
A
= 25°C
I
D
7.5
A
T
A
= 70°C 6.0
Power Dissipation
R
q
JA
t < 10 s (Note 1)
T
A
= 25°C P
D
1.95 W
Pulsed Drain Current T
A
= 25°C,
t
p
= 10 ms
I
DM
30 A
Operating Junction and Storage Temperature T
J
, T
STG
55 to
+150
°C
Source Current (Body Diode) I
S
2.0 A
Single Pulse DraintoSource Avalanche
Energy T
J
= 25°C, V
DD
= 30 V, V
GS
= 10 V,
I
L
= 7.5 A
pk
, L = 1.0 mH, R
G
= 25 W
EAS 28 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
THERMAL RESISTANCE RATINGS
Rating Symbol Max Unit
JunctiontoAmbient – Steady State (Note 1)
R
q
JA
110
°C/W
JunctiontoAmbient – t10 s (Note 1)
R
q
JA
64
JunctiontoFOOT (Drain)
R
q
JF
40
JunctiontoAmbient – Steady State (Note 2)
R
q
JA
183.5
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
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NChannel
30 V
36 mW @ 4.5 V
24 mW @ 10 V
R
DS(on)
Max
I
D
Max
V
(BR)DSS
7.5 A
Device Package Shipping
ORDERING INFORMATION
NTMD4840NR2G SOIC8
(PbFree)
2500/Tape & Reel
SOIC8
CASE 751
STYLE 11
4840N = Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
8
4840N
AYWW
G
1
8
MARKING DIAGRAM
& PIN ASSIGNMENT
S1 G1 S2 G2
D1 D1 D2 D2
D
G
S
NTMD4840N
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2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)jk
Characteristic
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
30 V
DraintoSource Breakdown Voltage Tem-
perature Coefficient
V
(BR)DSS
/T
J
18
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 24 V
T
J
= 25°C
1.0
mA
T
J
= 100°C
10
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±20 V ±100 nA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.5 3.0 V
Negative Threshold Temperature Coeffi-
cient
V
GS(TH)
/T
J
6.0
mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V I
D
= 6.9 A
16 24
mW
V
GS
= 4.5 V I
D
= 5.0 A
26 36
Forward Transconductance g
FS
V
DS
= 1.5 V, I
D
= 6.9 A 15 S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1.0 MHz, V
DS
= 15 V
520
pF
Output Capacitance C
OSS
140
Reverse Transfer Capacitance C
RSS
70
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 15 V, I
D
= 6.9 A
4.8
nC
Threshold Gate Charge Q
G(TH)
1.1
GatetoSource Charge Q
GS
2.1
GatetoDrain Charge Q
GD
1.9
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 15 V, I
D
= 6.9 A 9.5 nC
SWITCHING CHARACTERISTICS (Note 4)
TurnOn Delay Time
t
d(ON)
V
GS
= 10 V, V
DD
= 15 V,
I
D
= 1.0 A, R
G
= 3.0 W
7.6
ns
Rise Time t
r
5.0
TurnOff Delay Time t
d(OFF)
17
Fall Time t
f
3.0
DRAINTOSOURCE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V
I
D
= 2.0 A
T
J
= 25°C
0.76 1.0
V
T
J
= 125°C
0.58
ns
Reverse Recovery Time t
RR
V
GS
= 0 V, d
IS
/d
t
= 100 A/ms,
I
S
= 2.0 A
12.5
Charge Time T
a
7.3
Discharge Time T
b
5.2
Reverse Recovery Time Q
RR
6.0
nC
PACKAGE PARASITIC VALUES
Source Inductance
L
S
T
A
= 25°C
0.66 nH
Drain Inductance L
D
0.20 nH
Gate Inductance L
G
1.50 nH
Gate Resistance R
G
2.0 3.0
W
3. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
4. Switching characteristics are independent of operating junction temperatures.
NTMD4840N
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3
TYPICAL PERFORMANCE CURVES
T
J
= 125°C
V
DS
, DRAINTOSOURCE VOLTAGE (VOLTS)
I
D,
DRAIN CURRENT (AMPS)
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
GS
, GATETOSOURCE VOLTAGE (VOLTS)
Figure 3. OnResistance vs. GatetoSource
Voltage
V
GS
, GATETOSOURCE VOLTAGE (VOLTS)
R
DS(on),
DRAINTOSOURCE RESISTANCE (W)
I
D,
DRAIN CURRENT (AMPS)
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
Figure 5. OnResistance Variation with
Temperature
T
J
= 25°C
T
J
= 55°C
T
J
= 25°C
T
J
= 25°C
R
DS(on),
DRAINTOSOURCE RESISTANCE (W)
V
GS
= 10 V
Figure 6. DraintoSource Leakage Current
vs. Voltage
V
DS
, DRAINTOSOURCE VOLTAGE (VOLTS)
V
GS
= 0 V
I
DSS
, LEAKAGE (nA)
T
J
= 150°C
T
J
= 125°C
V
GS
= 4.5 V
V
DS
10 V
3.2 V
3.0 V
T
J
= 25°C
I
D
= 6.9 A
I
D,
DRAIN CURRENT (AMPS)
3.8 V
4.5 V
4 V
2.6 V
0
2
4
6
8
0 1.0 2.0 3.0
0
8
16
24
234
0.015
0.025
0.030
0.035
0.040
0.045
0.050
0.055
46 810
0.014
0.016
0.018
0.020
0.022
0.024
0.026
25 11
100
1000
10000
100000
51015202530
3.4 V
10V
4.2 V
2.8 V
0.060
10
12
5.04.0
1.5 2.5 3.5 4.5
3.5 8 14
4
12
20
3579
T
J
, JUNCTION TEMPERATURE (°C)
I
D
= 7.5 A
V
GS
= 10 V
R
DS(on),
DRAINTOSOURCE
RESISTANCE (NORMALIZED)
0.65
0.85
1.05
1.25
1.45
1.65
50 25 0 25 50 75 100 125 150
0.75
0.95
1.15
1.35
1.55
32
28
0.020
6.5 9.5 12.5
0.028
0.030

NTMD4840NR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET SO8 30V 7.5A 0.034R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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