PACKAGING INFORMATION ISSI
®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
02/12/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Plastic Ball Grid Array
Package Code: B (119-pin)
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protrusion and
should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within
0.004 inches at the seating plane.
MILLIMETERS INCHES
Sym. Min. Max. Min. Max.
N0.
Leads 119
A — 2.41 — 0.095
A1 0.50 0.70 0.020 0.028
A2 0.80 1.00 0.032 0.039
A3 1.30 1.70 0.051 0.067
A4 0.56 BSC 0.022 BSC
b 0.60 0.90 0.024 0.035
D 21.80 22.20 0.858 0.874
D1 20.32 BSC 0.800 BSC
D2 19.40 19.60 0.764 0.772
E 13.80 14.20 0.543 0.559
E1 7.62 BSC 0.300 BSC
E2 11.90 12.10 0.469 0.476
e 1.27 BSC 0.050 BSC
E1
A1
D1
7654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
E2
E
A2
SEATING PLANE
e
D2D
A
30ϒ
A3
A4
φ
b (119X)
