2
Electrical Specifications
1. Small/Large -signal data measured in a fully de-embedded test xture form TA = 25°C.
2. Pre-assembly into package performance veried 100% on-wafer per AMMC-6442 published specications.
3. This nal package part performance is veried by a functional test correlated to actual performance at one or more
frequencies.
4. Specications are derived from measurements in a 50 Ω test environment. Aspects of the amplier performance may
be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Гopt)
matching.
5. The Gain and P1dB tested at 37GHz and 40GHz guaranteed with measurement accuracy +/-1.5dB for gain and +/-
1.6dB for P1dB.
Table 1. RF Electrical Characteristics
TA=25°C, Vdd=5.0V, Idq=0.7V, Vg=-1V, Zo=50 Ω
Parameter Min Typ. Max Unit
Operational Frequency, Freq 37 40 GHz
Small-signal Gain, Gain 20 23 dB
Output Power at 1dB Gain Compression, P-1dB 28 30 dBm
Relative Third Order Inter-modulation level (∆f=10MHz, Po=+12dBm, SCL), IM3 36 dBc
Input Return Loss, RLin 8 dB
Output Return Loss, RLout 8 dB
Reverse Isolation, Isolation 45 dB
Table 2. Recommended Operating Range
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal
Resistance at backside temperature (Tb) = 25°C calculated from measured data.
Description Min. Typical Max. Unit Comments
Drain Supply Current, Idq 700 mA Vdd = 5V, Vg set for Idq Typical
Gate Supply Operating Voltage, Vg -1.3 -1 -0.7 V Idq=700mA