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ADRF5020BCCZN

P1-P3P4-P6P7-P9P10-P12P13-P13
ADRF5020 Data Sheet
Rev. A | Page 6 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
RF2
GND
GND
GND
GND
GND
RF1
GND
GND
GND
GND
RFC
GND
GND
GND
EN
VSS
CTRL
VDD
1
2
3
4
5
678910
11
12
13
14
15
1617181920
ADRF5020
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD MUST BE CONNECTED
TO THE RF/DC GROUND OF THE PRINTED
CIRCUIT BOARD (PCB).
14581-005
Figure 5. Pin Configuration (Top View)
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2, 4 to 7, 9, 10,
13, 16, 17, 19, 20
GND Ground. These pins must be connected to the RF/dc ground of the printed circuit board (PCB).
3 RFC
RF Common Port. This pin is dc-coupled to 0 V and ac matched to 50 Ω. No dc blocking capacitor is
necessary when the RF line potential is equal to 0 V dc. See Figure 6 for the interface schematic.
8 RF1
RF1 Port. This pin is dc-coupled to 0 V and ac matched to 50 Ω. No dc blocking capacitor is necessary
when the RF line potential is equal to 0 V dc. See Figure 6 for the interface schematic.
11 VDD Positive Supply Voltage.
12 CTRL Control Input. See Figure 7 for the interface schematic.
14 EN Enable Input. See Figure 7 for the interface schematic.
15 VSS Negative Supply Voltage.
18 RF2
RF2 Port. This pin is dc-coupled to 0 V and ac matched to 50 Ω. No dc blocking capacitor is necessary
when the RF line potential is equal to 0 V dc. See Figure 6 for the interface schematic.
EPAD Exposed Pad. The exposed pad must be connected to the RF/dc ground of the PCB.
INTERFACE SCHEMATICS
RFC,
RF1,
RF2
14581-006
Figure 6. RFC, RF1, and RF2 Pins Interface Schematic
CTRL, EN
V
DD
VDD
14581-007
Figure 7. Digital Pins (CTRL and EN) Interface Schematic
Data Sheet ADRF5020
Rev. A | Page 7 of 12
TYPICAL PERFORMANCE CHARACTERICS
INSERTION LOSS, RETURN LOSS, AND ISOLATION
Insertion loss and return loss measured on the probe matrix board using the ground, signal, ground (GSG) probes close to the RF pins;
isolation measured on an evaluation board because signal coupling between the probes limits the isolation performance of the ADRF5020
on the probe matrix board (see the Applications Information section for details of evaluation and probe matrix boards).
0
–5.0
–4.5
–4.0
–3.5
–3.0
–2.5
–2.0
–1.5
–1.0
–0.5
INSERTION LOSS (dB)
FREQUENCY (GHz)
0
40
3530
252015
105
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-008
Figure 8. Insertion Loss Between RFC and RF1/RF2 vs.
Frequency over Temperature
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
ISOLATION (dB)
FREQUENCY (GHz)
0 40
3530252015
105
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-009
Figure 9. Isolation Between RFC and RF1/RF2 vs.
Frequency over Temperature
0
–50
–45
–40
–35
–30
–25
–20
–15
–10
–5
RETURN LOSS (dB)
FREQUENCY (GHz)
0 40353025
20
1510
5
RF2 OFF
RF1 ON
RFC
14581-010
Figure 10. Return Loss vs. Frequency for RFC, RF1 On, and RF2 Off
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
ISOLATION (dB)
FREQUENCY (GHz)
0
40353025201510
5
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-0
11
Figure 11. Isolation Between RF1 and RF2
vs. Frequency over Temperature
ADRF5020 Data Sheet
Rev. A | Page 8 of 12
INPUT POWER COMPRESSION AND THIRD-ORDER INTERCEPT (IP3)
All large signal performance parameters were measured on the evaluation board.
32
10
12
14
16
18
20
22
24
26
30
28
INPUT P0.1dB (dBm)
FREQUENCY (GHz)
0 30
25
2015105
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-012
Figure 12. Input 0.1 dB Power Compression (P0.1dB) vs.
Frequency over Temperature
32
10
12
14
16
18
20
22
24
26
30
28
INPUT P1dB (dBm)
FREQUENCY (GHz)
0 30
25
2015
105
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-013
Figure 13. Input 1 dB Power Compression (P1dB) vs. Frequency over
Temperature
60
20
25
30
35
40
45
50
55
INPUT IP3 (dBm)
FREQUENCY (GHz)
0 30252015105
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-014
Figure 14. Input IP3 vs. Frequency over Temperature
32
10
12
14
16
18
20
22
24
26
28
30
INPUT P0.1dB (dBm)
FREQUENCY (Hz)
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-015
10k 1M 100M100k 10M 1G
Figure 15. Input 0.1 dB Power Compression (P0.1dB) vs. Frequency over
Temperature (Low Frequency Detail)
32
10
12
14
16
18
20
22
24
26
28
30
INPUT P1dB (dBm)
FREQUENCY (Hz)
10k 1M 100M100k 10M
1G
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-016
Figure 16. Input 1 dB Power Compression (P1dB) vs. Frequency over
Temperature (Low Frequency Detail)
60
20
25
30
35
40
45
50
55
INPUT IP3 (dBm)
FREQUENCY (Hz)
10k 1M 100M100k 10M 1G
T
CASE
= –40°C
T
CASE
= +25°C
T
CASE
= +85°C
14581-017
Figure 17. Input IP3 vs. Frequency over Temperature
(Low Frequency Detail)
P1-P3P4-P6P7-P9P10-P12P13-P13

ADRF5020BCCZN

Mfr. #:
Buy ADRF5020BCCZN
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs High isolation SPDT, 30GHz, fast switchi
Lifecycle:
New from this manufacturer.
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