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CY2CC810OXCT

P1-P3P4-P6P7-P9
CY2CC810
Document #: 38-07056 Rev. *E Page 7 of 9
Package Drawing and Dimensions
Figure 12. 20-Lead (300-Mil) SOIC S20.3/SZ20.3
Ordering Information
Part Number Package Type Product Flow
CY2CC810OI 20-pin SSOP Industrial, –40°C to 85°C
CY2CC810OIT 20-pin SSOP–Tape and Reel Industrial, –40°C to 85°C
CY2CC810OC 20-pin SSOP Commercial, 0°C to 70°C
CY2CC810OCT 20-pin SSOP–Tape and Reel Commercial, 0°C to 70°C
Lead-free
CY2CC810OXC 20-pin SSOP Commercial, 0°C to 70°C
CY2CC810OXCT 20-pin SSOP–Tape and Reel Commercial, 0°C to 70°C
CY2CC810OXI 20-pin SSOP Industrial, –40°C to 85°C
CY2CC810OXIT 20-pin SSOP–Tape and Reel Industrial, –40°C to 85°C
PIN 1 ID
SEATING PLANE
0.497[12.623]
0.513[13.030]
110
11 20
*
*
*
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
PART #
S20.3 STANDARD PKG.
SZ20.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.55gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85024-*C
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CY2CC810
Document #: 38-07056 Rev. *E Page 8 of 9
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Figure 13. 20-lead (5.3-mm) Shrunk Small Outline Package O20
All product and company names mentioned in this document are the trademarks of their respective holders.
51-85077-*C
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CY2CC810
Document #: 38-07056 Rev. *E Page 9 of 9
Document History Page
Document Title: CY2CC810 1:10 Clock Fanout Buffer
Document #: 38-07056
REV. ECN NO. Issue Date
Orig. of
Change
Description of Change
** 107081 06/07/01 IKA Convert from IMI to Cypress
*A 114315 05/09/02 TSM ∆ I
DD
Validation
*B 119117 10/07/02 RGL Added 5.8 as the Max. value of V
IH
in the DC Electrical Characteristics
@3.3V table.
Changed the Max. value of V
IH
from 1.8 to 5.0 in the DC Electrical Charac-
teristics @2.5V table.
*C 122743 12/14/02 RBI Added power up requirements to maximum ratings information.
*D 387761 See ECN RGL Added typical values
Updated jitter and skew specs.
Removed devices with SOIC package
Added Lead-free SSOP package
*E 499991 See ECN RGL Added tpu parameter in the Power Supply Characteristics table
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P1-P3P4-P6P7-P9

CY2CC810OXCT

Mfr. #:
Buy CY2CC810OXCT
Manufacturer:
Cypress Semiconductor
Description:
IC CLK BUFFER 1:10 650MHZ 20SSOP
Lifecycle:
New from this manufacturer.
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