Characteristics BAT41
4/12 Doc ID 12633 Rev 2
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
Figure 7. Forward voltage drop versus
forward current (typical values)
Figure 8. Variation of thermal impedance
junction to ambient versus pulse
duration
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
I (A)
FM
V (V)
FM
T =25°C
j
T =100°C
j
T =125°C
j
10
100
1000
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z (°C/W)
th(j-a)
Single pulse
t (s)
p
SOT323-6L
printed circuit board, epoxy FR4, e = 35 µm, SOT323-6L
CU
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z/R
th(j-a) th(j-a)
t (s)
p
SOT-23
Alumine substrate
10 x 8 x 0.5 mm
SOD-323
Epoxy FR4
S = 2.25 mm
e = 35 µm
CU
2
CU
Single pulse
printed circuit board, epoxy Fr4, e = 35 µm, SOD-323
CU
Allumine substrate, SOT-23
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z/R
th(j-a) th(j-a)
t (s)
p
SOD-523
Epoxy FR4
e = 35 µm
CU
SOT-666
Epoxy FR4
e = 35 µm
CU
Single pulse
printed circuit board, epoxy FR4, e = 35 µm, SOT-666 and SOD-523
CU
300
350
400
450
500
550
600
0 5 10 15 20 25 30 35 40 45 50
S (mm²)
CU
R (°C/W)
th(j-a)
printed circuit board, epoxy Fr4, e = 35 µm, SOD-323
CU
