0.5 GHz to 80 GHz, GaAs, HEMT, MMIC,
Low Noise Wideband Amplifier
Data Sheet
HMC-AUH312
Rev. E Document Feedback
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FEATURES
Small signal gain: >8 dB
80 GHz distributed amplifier
Configurable with or without bias tees for V
DD
and V
GG
1 bias
Low power dissipation
300 mW with bias tee at V
DD
= 5 V
360 mW without bias tee at V
DD
= 6 V
480 mW without bias tee at V
DD
= 8 V
Die size: 1.2 mm × 1.0 mm × 0.1 mm
APPLICATIONS
Fiber optic modulator drivers
Fiber optic photoreceiver postamplifiers
Low noise amplifier for test and measurement equipment
Point to point and point to multipoint radios
Wideband communication and surveillance systems
Radar warning receivers
FUNCTIONAL BLOCK DIAGRAM
F
igure 1.
GENERAL DESCRIPTION
The HMC-AUH312 is a gallium arsenide (GaAs), monolithic
microwave integrated circuit (MMIC), HEMT, low noise,
wideband amplifier die that operates between 500 MHz and
80 GHz, providing a typical 3 dB bandwidth of 80 GHz. The
amplifier provides 10 dB of small signal gain and a maximum
output amplitude of 2.5 V p-p, which makes it ideal for use in
broadband wireless, fiber optic communications, and test
equipment applications.
The amplifier die occupies 1.2 mm × 1.0 mm, facilitating easy
integration into a multichip module (MCM). The HMC-AUH312
can be used with or without a bias tee, and requires off-chip
blocking components and bypass capacitors for the dc supply
lines. Adjustable gate voltages allow for gain adjustment.
HMC-AUH312
V
GG
1
V
GG
2V
DD
RFIN/V
GG
1
RFOUT/
V
DD
1
3
4
5
2
13476-001
HMC-AUH312 Data Sheet
Rev. E | Page 2 of 17
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
0.5 GHz to 60 GHz Frequency Range ........................................ 3
60 GHz to 80 GHz Frequency Range ......................................... 3
Recommended Operating Conditions ...................................... 3
Absolute Maximum Ratings ............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Interface Schematics..................................................................... 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 11
Applications Information .............................................................. 12
Applications Overview .............................................................. 12
Device Mounting ........................................................................ 14
Device Operation ....................................................................... 14
Mounting and Bonding Techniques for Millimeterwave GaAs
MMICs ............................................................................................. 15
Handling Guidelines for ESD Protection of GaAs MMICs .. 15
Handling Precautions ................................................................ 15
Mounting Techniques ................................................................ 16
Wire Bonding .............................................................................. 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 17
REVISION HISTORY
11/15v04.0615 to Rev. E
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Updated Format .................................................................. Universal
Changes to Title of Data Sheet ............................................... Page 1
Change Vg1 to V
GG
1, Vg2 to V
GG
2, Vd to V
DD
, RFIN to
RFIN/V
GG
1, and RFOUT to RFOUT/V
DD
.................. Throughout
Changes to General Description Section ...................................... 1
Changes to Gain Parameter, Table 2 .............................................. 3
Changes to Power Dissipation Parameter and Operating
Temperature Parameter, Table 3 ..................................................... 3
Changes to Power Dissipation Parameter and Operating
Temperature Parameter, Table 4 ..................................................... 4
Changes to Table 5 ............................................................................ 5
Added Figure 2, Renumbered Sequentially .................................. 6
Changes to Table 6 ............................................................................ 6
Added Interface Schematics Section ............................................... 7
Changes to Figure 3 ........................................................................... 7
Changes to Figure 14, Figure 16, and Figure 19 ............................ 9
Changes to Figure 20...................................................................... 10
Added Theory of Operation Section and Figure 21 .................. 11
Added Applications Information Section and Applications
Overview Section............................................................................ 12
Changes to Figure 24 and Figure 25 ............................................ 13
Changes to Device Power-Up Instructions Section and Device
Power-Down Instructions Section ............................................... 14
Added Handling Guidelines for ESD Protection of GaAs MMICs
Section and Opening the Protective Packaging Section ................ 15
Changes to Handling Precautions Section .................................. 15
Changes to Mounting Techniques Section ................................. 16
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 17
Data Sheet HMC-AUH312
Rev. E | Page 3 of 17
SPECIFICATIONS
T
A
= 25°C, V
DD
= 8 V, V
GG
2 = 1.8 V, I
DD
= 60 mA, unless otherwise noted.
0.5 GHz to 60 GHz FREQUENCY RANGE
Table 1.
Parameter
Symbol
Min
Typ
Unit
Test Conditions/Comments
FREQUENCY RANGE 0.5 60 GHz
GAIN 8 10 dB
RETURN LOSS
Input
15
dB
Output 17 dB
OUTPUT
Output Power for 1 dB
Compression
P1dB 13.5 dBm
Saturated Output Power P
SAT
16 dBm
Output Third-Order Intercept IP3 23 dBm
NOISE FIGURE 5 dB
SUPPLY CURRENT I
DD
60 mA V
DD
= 8 V, adjust V
GG
1 between 2 V and 0 V to achieve I
DD
=
60 mA typical
60 GHz to 80 GHz FREQUENCY RANGE
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE 60 80 GHz
GAIN 9 dB
RETURN LOSS
Input 10 dB
Output 15 dB
OUTPUT
Output Power for 1 dB
Compression
P1dB 13 dBm
Saturated Output Power P
SAT
15 dBm
Output Third-Order Intercept IP3 22 dBm
NOISE FIGURE dB
SUPPLY CURRENT I
DD
60 mA V
DD
= 8 V, adjust V
GG
1 between 2 V and 0 V to achieve I
DD
=
60 mA typical
RECOMMENDED OPERATING CONDITIONS
Table 3. Recommended Operating Conditions with Bias Tee
Parameter Symbol Min Typ Max Unit
POSITIVE SUPPLY
Voltage 3 5 6 V
Current 60 80 mA
GATE VOLTAGE
Gate Voltage 1 V
GG
1 −1 +0.3 V
Gate Voltage 2
V
GG
2
1.8
V
POWER DISSIPATION 300 mW
RF INPUT POWER 4 dBm
OPERATING TEMPERATURE 55 +25 +85 °C

HMC-AUH312

Mfr. #:
Manufacturer:
Analog Devices / Hittite
Description:
RF Amplifier GaAs HEMT WBand Driver amp, DC - 65 GHz
Lifecycle:
New from this manufacturer.
Delivery:
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