PBSS8110X_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 December 2009 3 of 15
NXP Semiconductors
PBSS8110X
100 V, 1 A NPN low V
CEsat
(BISS) transistor
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 120 V
V
CEO
collector-emitter voltage open base - 100 V
V
EBO
emitter-base voltage open collector - 5 V
I
C
collector current (DC) - 1 A
I
CM
peak collector current single pulse;
t
p
1ms
-3A
I
B
base current (DC) - 300 mA
P
tot
total power dissipation T
amb
25 °C
[1]
-0.55W
[2]
-1.4W
[3]
-2.0W
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
T
stg
storage temperature 65 +150 °C
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB; mounting pad for collector 6cm
2
(3) FR4 PCB; standard footprint
Fig 1. Power derating curves
T
amb
(°C)
0 16012040 80
006aaa408
0.8
1.2
0.4
1.6
2.0
P
tot
(W)
0
(1)
(2)
(3)
PBSS8110X_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 December 2009 4 of 15
NXP Semiconductors
PBSS8110X
100 V, 1 A NPN low V
CEsat
(BISS) transistor
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 227 K/W
[2]
--89K/W
[3]
--63K/W
R
th(j-sp)
thermal resistance from
junction to solder point
--16K/W
FR4 PCB; standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse time; typical values
006aaa409
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
duty cycle =
PBSS8110X_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 December 2009 5 of 15
NXP Semiconductors
PBSS8110X
100 V, 1 A NPN low V
CEsat
(BISS) transistor
FR4 PCB; mounting pad for collector 6cm
2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse time; typical values
Ceramic PCB, Al
2
O
3
, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse time; typical values
006aaa411
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
duty cycle =
006aaa410
10
1
10
2
Z
th(j-a)
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
duty cycle =

PBSS8110X,135

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT LO VCESAT(BISS)TRANS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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