MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER
MP3360 Rev. 0.9 www.MonolithicPower.com 2
1/29/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature (T
A
)
MP3360 10-pin, 2x2 Flip QFN 4KY
-40°C to +85°C
For Tape & Reel, add suffix –Z (e.g. MP3360DG–Z);
For RoHS Compliant Packaging, add suffix –LF(e.g. MP3360DG–LF–Z)
PACKAGE REFERENCE
TOP VIEW
1
2
3
4
5
10
FB
VIGBT
VIN
AGND
PGND
CHG
9
8
7
6
IGBTIN
IGBTOUT
SW
RDYB
ABSOLUTE MAXIMUM RATINGS
(1)
V
IN
to GND .........................................-0.3Vto 6V
CHG, IGBTIN, IGBTOUT, VIGBT,
RDYB to AGND .................................-0.3Vto 6V
FB to AGND...................................-60V to 350V
SW to AGND...................................-0.3V to 60V
PGND to AGND ...........................-0.3V to +0.3V
2X2, 10 pin Flip Chip Thermal Resistance
Operating Temperature Ranges .........................
............................................. -20°C to +85°C
Storage Temperature............... -55°C to +150°C
Junction Temperature............................ +150°C
Continuous Power Dissipation (T
A
= +25°C)
(2)
………………………………………………....1.6W
Lead Temperature (Solder).....................+260°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
.............................2.5V to 6V
Operating Junct. Temp (T
J
)...... -40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
2x2 Flip Chip ...........................80 ...... 16 ... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/θ
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its operating
conditions.
4) Measured on JESD51-7, 4-layer PCB.
