NXP Semiconductors
MF3D(H)x2
MIFARE DESFire EV2 contactless multi-application IC
MF3Dx2_MF3DHx2_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product short data sheet Rev. 3.1 — 17 May 2018
COMPANY PUBLIC 364231 25 / 27
Tables
Tab. 1. Key differences between MIFARE DESFire
generations ........................................................4
Tab. 2. Quick reference data Stresses above one or
more of the values may cause permanent
damage to the device.Exposure to limiting
values for extended periods may affect
device reliability. ................................................7
Tab. 3. Ordering information ..........................................8
Tab. 4. Limiting values Stresses above one or more
of the limiting values may cause permanent
damage to the device.Exposure to limiting
values for extended periods may affect
device reliability. ..............................................10
Tab. 5. Secure messaging commands overview ......... 15
Tab. 6. Memory and configuration management
commands overview ........................................15
Tab. 7. Key management commands overview ...........15
Tab. 8. Application management commands
overview .......................................................... 16
Tab. 9. File management commands overview ........... 16
Tab. 10. Data management commands overview ......... 17
Tab. 11. Transaction management commands
overview .......................................................... 17
Tab. 12. ISO/IEC 7816-4 support commands
overview .......................................................... 18
Tab. 13. Virtual Card commands overview ....................18
Tab. 14. Proximity Check commands overview .............18
Tab. 15. Originality Check commands overview ............19
Tab. 16. Abbreviations ...................................................20
Tab. 17. Revision history ...............................................22
NXP Semiconductors
MF3D(H)x2
MIFARE DESFire EV2 contactless multi-application IC
MF3Dx2_MF3DHx2_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product short data sheet Rev. 3.1 — 17 May 2018
COMPANY PUBLIC 364231 26 / 27
Figures
Fig. 1. Evolution of MIFARE DESFire .......................... 2
Fig. 2. MIFARE DESFire EV2 IC block diagram ...........9
Fig. 3. MIFARE DESFire EV2 product-based
application and file structure ........................... 11
NXP Semiconductors
MF3D(H)x2
MIFARE DESFire EV2 contactless multi-application IC
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2018. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 May 2018
Document identifier: MF3Dx2_MF3DHx2_SDS
Document number: 364231
Contents
1 General description ............................................ 1
1.1 Introduction ........................................................ 1
1.2 Evolution of MIFARE DESFire products
family ..................................................................2
2 Features and benefits .........................................3
2.1 Features overview ............................................. 3
2.1.1 RF interface: ISO/IEC 14443 Type A .................3
2.1.2 Non-volatile memory ..........................................3
2.1.3 NV-memory organization ................................... 3
2.1.4 Security .............................................................. 3
2.1.5 New features on MIFARE DESFire EV2 ............4
2.1.6 ISO/IEC 7816 compatibility ................................4
2.1.7 Special features .................................................4
2.2 Summary of key differences between
MIFARE DESFire generations ...........................4
3 Applications .........................................................6
4 Quick reference data .......................................... 7
5 Ordering information .......................................... 8
6 Block diagram ..................................................... 9
7 Limiting values ..................................................10
8 Functional description ......................................11
8.1 Introduction ...................................................... 11
8.2 Contactless energy and data transfer ..............12
8.3 Anti-collision .....................................................12
8.4 UID/serial number ............................................12
8.5 Memory organization ....................................... 13
8.6 Available file types ...........................................13
8.7 Security ............................................................13
9 DESFire command set ......................................15
9.1 Secure Messaging Commands ........................15
9.2 Memory and Configuration Management
Commands .......................................................15
9.3 Key Management Commands ......................... 15
9.4 Application Management Commands .............. 16
9.5 File Management Commands ..........................16
9.6 Data Management Commands ........................17
9.7 Transaction Management Commands .............17
9.8 ISO/IEC 7816-4 Standard Commands .............18
9.9 Virtual Card Commands .................................. 18
9.10 Proximity Check Commands ........................... 18
9.11 Originality Check Commands .......................... 19
10 Abbreviations .................................................... 20
11 References ......................................................... 21
12 Revision history ................................................ 22
13 Legal information .............................................. 23

MF3D2201DUF/00V

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Manufacturer:
NXP Semiconductors
Description:
RFID Transponders MIFARE DESFire EV2 contactless multi-application IC
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