NXP Semiconductors
MF3D(H)x2
MIFARE DESFire EV2 contactless multi-application IC
MF3Dx2_MF3DHx2_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product short data sheet Rev. 3.1 — 17 May 2018
COMPANY PUBLIC 364231 8 / 27
5 Ordering information
Table 3. Ordering information
Type number Package Description Version
MF3D8201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 8K EE, 17pF input
capacitance
-
MF3D4201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 4K EE, 17pF input
capacitance
-
MF3D2201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 2K EE, 17pF input
capacitance
-
MF3DH8201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 8K EE, 70pF input
capacitance
MF3DH4201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 4K EE, 70pF input
capacitance
MF3DH2201DUD/00 FFC 8 inch wafer (sawn; 120 μm thickness)
[1][2]
; 2K EE 70pF input capacitance
MF3D8201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 8K EE, 17pF input capacitance -
MF3D4201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 4K EE, 17pF input capacitance -
MF3D2201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 2K EE, 17pF input capacitance -
MF3DH8201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 8K EE, 70pF input capacitance -
MF3DH4201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 4K EE, 70pF input capacitance -
MF3DH2201DUF/00 FFC 8 inch wafer (sawn; 75 μm thickness)
[1][2]
; 2K EE, 70pF input capacitance -
MF3D8200DA4/00 MOA4 plastic leadless module carrier package; 8K EE, 17pF input capacitance SOT500-2
MF3D4200DA4/00 MOA4 plastic leadless module carrier package; 4K EE, 17pF input capacitance SOT500-2
MF3D2200DA4/00 MOA4 plastic leadless module carrier package; 2K EE, 17pF input capacitance SOT500-2
MF3DH8200DA4/00 MOA4 plastic leadless module carrier package; 8K EE, 70pF input capacitance SOT500-2
MF3DH4200DA4/00 MOA4 plastic leadless module carrier package; 4K EE, 70pF input capacitance SOT500-2
MF3DH2200DA4/00 MOA4 plastic leadless module carrier package; 2K EE, 70pF input capacitance SOT500-2
MF3D8200DA6/00 MOB6 plastic leadless module carrier package; 8K EE, 17pF input capacitance SOT500-3
MF3D4200DA6/00 MOB6 plastic leadless module carrier package; 4K EE, 17pF input capacitance SOT500-3
MF3D2200DA6/00 MOB6 plastic leadless module carrier package; 2K EE, 17pF input capacitance SOT500-3
MF3DH8200DA6/00 MOB6 plastic leadless module carrier package; 8K EE, 70pF input capacitance SOT500-3
MF3DH4200DA6/00 MOB6 plastic leadless module carrier package; 4K EE, 70pF input capacitance SOT500-3
MF3DH2200DA6/00 MOB6 plastic leadless module carrier package; 2K EE, 70pF input capacitance SOT500-3
[1] Delivered on film frame carrier with electronic fail die marking according to SECSII format.
[2] See [2]
