PMBTA42DS_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 27 August 2009 3 of 10
NXP Semiconductors
PMBTA42DS
NPN/NPN high-voltage double transistors
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm
2
.
[3] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Per device
P
tot
total power dissipation T
amb
≤ 25 °C
[1]
- 420 mW
[2]
- 560 mW
[3]
- 700 mW
T
j
junction temperature - 150 °C
T
amb
ambient temperature −65 +150 °C
T
stg
storage temperature −65 +150 °C
Table 5. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 431 K/W
[2]
- - 338 K/W
[3]
- - 278 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
- - 105 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 298 K/W
[2]
- - 223 K/W
[3]
- - 179 K/W