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GTL2034PW,118

P1-P3P4-P6P7-P9P10-P12P13-P13
9397 750 13543 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 11 November 2005 7 of 13
Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
11. Dynamic characteristics
[1] All typical values are at V
CC
= 3.3 V and T
amb
=25°C.
11.1 Waveforms
V
M
=V
ref
for B ports.
12. Test information
Table 9: Dynamic characteristics
V
CC
= 3.3 V
±
0.3 V
Symbol Parameter Conditions Min Typ
[1]
Max Unit
GTL−; V
ref
= 0.6 V; V
TT
= 0.9 V
t
PLH
LOW-to-HIGH propagation delay BIn to BOn;
see
Figure 4
- 2.8 8 ns
t
PHL
HIGH-to-LOW propagation delay - 5.2 10 ns
GTL; V
ref
= 0.8 V; V
TT
= 1.2 V
t
PLH
LOW-to-HIGH propagation delay BIn to BOn;
see
Figure 4
- 3.1 8 ns
t
PHL
HIGH-to-LOW propagation delay - 4.1 10 ns
GTL+; V
ref
= 1.0 V; V
TT
= 1.5 V
t
PLH
LOW-to-HIGH propagation delay BIn to BOn;
see
Figure 4
- 3.3 8 ns
t
PHL
HIGH-to-LOW propagation delay - 3.6 10 ns
a. Pulse duration b. Propagation delay times
Fig 4. Voltage waveforms
002aab140
3.0 V
0 V
t
pulse
V
M
V
M
002aab149
V
TT
1
/
3
V
TT
V
OH
V
OL
t
PLH
t
PHL
V
ref2
V
ref
V
ref
V
ref1
input
output
C
L
= load capacitance; includes jig and probe capacitance.
R
T
= termination resistance; should be equal to Z
o
of pulse generator.
Fig 5. Load circuit for B outputs
PULSE
GENERATOR
D.U.T.
V
O
C
L
30 pF
25 Ω
002aab143
R
T
V
I
V
CC
V
TT
9397 750 13543 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 11 November 2005 8 of 13
Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
13. Package outline
Fig 6. Package outline SOT402-1 (TSSOP14)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153
99-12-27
03-02-18
w M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
9397 750 13543 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 11 November 2005 9 of 13
Philips Semiconductors
GTL2034
4-bit GTL to GTL buffer
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °Cto270°C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm
3
so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
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GTL2034PW,118

Mfr. #:
Buy GTL2034PW,118
Manufacturer:
NXP Semiconductors
Description:
Buffers & Line Drivers 4-BIT GTL TO GTL BUF
Lifecycle:
New from this manufacturer.
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