HMC773ALC3B Data Sheet
Rev. D | Page 22 of 22
OUTLINE DIMENSIONS
03-02-2017-A
PKG-004837
0.50
BSC
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
0.08
BSC
1
4
6
7
9
10
12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.36
0.30
0.24
PIN 1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
0.90
0.80
0.70
SEATING
PLANE
Figure 79. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
MSL
Rating
2
Description
3
Package
Option Branding
4
12-Terminal Ceramic Leadless Chip Carrier [LCC]
12-Terminal Ceramic Leadless Chip Carrier [LCC]
12-Terminal Ceramic Leadless Chip Carrier [LCC]
EV1HMC773ALC3B Evaluation PCB Assembly
1
All models are RoHS Compliant.
2
The maximum peak reflow temperature is 260°C (see the Absolute Maximum Ratings section).
3
HMC773ALC3B, HMC773ALC3BTR, and HMC773ALC3BTR-R5 body package material is alumina ceramic and the lead finish is gold over nickel.
4
HMC773ALC3B, HMC773ALC3BTR, and HMC773ALC3BTR-R5 4-digit lot number is represented by XXXX.
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D13669-0-9/17(D)
