HMC773ALC3B Datasheet HMC773ALC3B, HMC773ALC3BTR, HMC773ALC3BTR-R5 | P4-P6

HMC773ALC3B Data Sheet

Rev. D | Page 4 of 22

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

RF Input Power 21 dBm

LO Input Power

21 dBm

IF Input Power 21 dBm

IF Source and Sink Current 2 mA

Channel Temperature 175°C

Continuous P

DISS

(T = 85°C) (Derate 4.44 mw/°C

Above 85°C)

400 mW

Maximum Peak Reflow Temperature (MSL3)

260°C

Storage Temperature Range −65°C to +150°C

Operating Temperature Range −40°C to +85°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM) 2000 V (Class 2)

Field Induced Charged Device Model

(FICDM)

1200 V (Class C5)

See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

is the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type θ

Unit

E-12-4

120 225 °C/W

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

Data Sheet HMC773ALC3B

Rev. D | Page 5 of 22

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND

NIC

GND

NIC

GND

456

12 11 10

HMC773ALC3B

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE PINS

ARE NOT CONNECTED INTERNALLY. HOWEVER, ALL

DATA SHOWN HEREIN WAS MEASURED WITH THESE

PINS CONNECTED TO RF/DC GROUND EXTERNALLY.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF/DC GROUND.

PACKAGE

BASE

13669-002

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No. Mnemonic Description

1, 3, 7, 9, 10, 12 GND

Ground. Connect these pins and package bottom to RF/dc ground. See Figure 3 for the GND interface

schematic.

2 LO

Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface

schematic.

4, 6, 11 NIC

Not Internally Connected. These pins are not connected internally. However, all data shown herein was

measured with these pins connected to RF/dc ground externally.

5 IF

Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc,

block this pin externally using a series capacitor with a value that passes the necessary IF frequency

range. For operation to dc, to prevent device malfunction or failure, this pin must not source or sink

more than 2 mA of current. See Figure 5 for the IF interface schematic.

8 RF

Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the RF interface

schematic.

EP Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

GND

13669-003

Figure 3. GND Interface

13669-004

Figure 4. LO Interface

13669-005

Figure 5. IF Interface

13669-006

Figure 6. RF Interface

HMC773ALC3B Data Sheet

Rev. D | Page 6 of 22

TYPICAL PERFORMANCE CHARACTERISTICS

DOWNCONVERTER, UPPER SIDEBAND, IF = 500 MHz

–2

–4

–6

–8

–10

–12

–14

–16

–18

–20

6 8 10 12 14 16 18 20 22 24 26

CONVERSION GAIN (dB)

RF FREQUENCY (GHz)

+85°C

+25°C

–40°C

13669-007

Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,

LO Drive = 13 dBm

–2

–4

–6

–8

–10

–12

–14

–16

–18

–20

6 8 10 12 14 16 18 20 22 24 26

CONVERSION GAIN (dB)

RF FREQUENCY (GHz)

9dBm

11dBm

13dBm

15dBm

17dBm

13669-008

Figure 8. Conversion Gain vs. RF Frequency at Various LO Drives

0 2 4 6 8 10 12

IF FREQUENCY (GHz)

–2

–4

–6

–8

–10

–12

–14

–16

–18

–20

CONVERSION GAIN, RETURN LOSS (dB)

13669-009

CONVERSION GAIN

IF RETURN LOSS

Figure 9. Conversion Gain and Return Loss vs. IF Frequency,

LO Drive = 13 dBm

ISOLATION (dB)

6 8

10 12

16 18

20 22

24 26

RF FREQUENCY (GHz)

LO TO RF

RF TO IF

LO TO IF

13669-010

Figure 10. Isolation vs. RF Frequency

–5

–10

–15

–20

–25

–30

–35

LO PORT RETURN LOSS (dB)

6 8 10 12 14 16 18 20 22 24

LO FREQUENCY (GHz)

+85°C

+25°C

–40°C

13669-011

Figure 11. LO Port Return Loss vs. LO Frequency, LO Drive = 13 dBm

–5

–10

–15

–20

–25

–30

–35

RF PORT RETURN LOSS (dB)

6 8 10 12 14 16 18 20 22 24 26

RF FREQUENCY (GHz)

+85°C

+25°C

–40°C

13669-012

Figure 12. RF Port Return Loss vs. RF Frequency,

LO Frequency = 16 GHz, LO Drive = 13 dBm

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P22

HMC773ALC3B

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