LTC1407/LTC1407A
13
1407fb
APPLICATIONS INFORMATION
INPUT RANGE
The analog inputs of the LTC1407/LTC1407A may be driven
fully differentially with a single supply. Either input may
swing up to 3V, provided the differential swing is no greater
than 2.5V. In the valid input range, the noninverting input
of each channel should always be more positive than the
inverting input of each channel. The 0V to 2.5V range is
also ideally suited for single-ended input use with single
supply applications. The common mode range of the
inputs extend from ground to the supply voltage V
DD
. If
the difference between the CH0
+
and CH0
inputs or the
CH1
+
and CH1
inputs exceeds 2.5V, the output code will
stay fi xed at all ones, and if this difference goes below 0V,
the ouput code will stay fi xed at all zeros.
INTERNAL REFERENCE
The LTC1407/LTC1407A have an on-chip, temperature
compensated, bandgap reference that is factory trimmed
near 2.5V to obtain a precise 2.5V input span. The refer-
ence amplifi er output V
REF
, (Pin 3) must be bypassed with
a capacitor to ground. The reference amplifi er is stable
with capacitors of 1µF or greater. For the best noise per-
formance, a 10µF ceramic or a 10µF tantalum in parallel
with a 0.1µF ceramic is recommended. The V
REF
pin can be
overdriven with an external reference as shown in Figure 2.
The voltage of the external reference must be higher than
the 2.5V of the open-drain P-channel output of the internal
reference. The recommended range for an external refer-
ence is 2.55V to V
DD
. An external reference at 2.55V will
see a DC quiescent load of 0.75mA and as much as 3mA
during conversion.
INPUT SPAN VERSUS REFERENCE VOLTAGE
The differential input range has a unipolar voltage span that
equals the difference between the voltage at the reference
buffer output V
REF
(Pin 3) and the voltage at the Exposed
Pad ground. The differential input range of ADC is 0V to
2.5V when using the internal reference. The internal ADC
is referenced to these two nodes. This relationship also
holds true with an external reference.
DIFFERENTIAL INPUTS
The ADC will always convert the unipolar difference of
CH0
+
minus CH0
or the unipolar difference of CH1
+
mi-
nus CH1
, independent of the common mode voltage at
either set of inputs. The common mode rejection holds up
at high frequencies (see Figure 3.) The only requirement
is that both inputs not go below ground or exceed V
DD
.
Figure 2
Figure 3. CMRR vs Frequency
LTC1407/
LTC1407A
V
REF
GND
1407 F02
3
11
10µF
3V REF
FREQUENCY (Hz)
–80
CMRR (dB)
–40
0
–100
–60
–20
100 1k
1407 G08
–120
10k 100k 1M 10M 100M
CH0 CH1
LTC1407/LTC1407A
14
1407fb
APPLICATIONS INFORMATION
Integral nonlinearity errors (INL) and differential nonlinear-
ity errors (DNL) are largely independent of the common
mode voltage. However, the offset error will vary. CMRR
is typically better than 60dB.
Figure 4 shows the ideal input/output characteristics for
the LTC1407/LTC1407A. The code transitions occur mid-
way between successive integer LSB values (i.e., 0.5LSB,
1.5LSB, 2.5LSB, FS – 1.5LSB). The output code is natural
binary with 1LSB = 2.5V/16384 = 153µV for the LTC1407A
and 1LSB = 2.5V/4096 = 610µV for the LTC1407. The
LTC1407A has 1LSB RMS of Gaussian white noise.
Board Layout and Bypassing
Wire wrap boards are not recommended for high resolu-
tion and/or high speed A/D converters. To obtain the best
performance from the LTC1407/LTC1407A, a printed circuit
board with ground plane is required. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track. If optimum phase match between
the inputs is desired, the length of the four input wires of
the two input channels should be kept matched. But each
pair of input wires to the two input channels should be
kept separated by a ground trace to avoid high frequency
crosstalk between channels.
High quality tantalum and ceramic bypass capacitors
should be used at the V
DD
and V
REF
pins as shown in the
Block Diagram on the fi rst page of this data sheet. For
optimum performance, a 10µF surface mount tantalum
capacitor with a 0.1µF ceramic is recommended for the V
DD
and V
REF
pins. Alternatively, 10µF ceramic chip capacitors
such as X5R or X7R may be used. The capacitors must
be located as close to the pins as possible. The traces
connecting the pins and the bypass capacitors must be
kept short and should be made as wide as possible. The
V
DD
bypass capacitor returns to GND (Pin 6) and the
V
REF
bypass capacitor returns to the Exposed Pad ground
(Pin 11). Care should be taken to place the 0.1µF V
DD
bypass capacitor as close to Pins 6 and 7 as possible.
Figure 5 shows the recommended system ground connec-
tions. All analog circuitry grounds should be terminated at
the LTC1407/LTC1407A Exposed Pad. The ground return
from the LTC1407/LTC1407A Pin 6 to the power supply
should be low impedance for noise-free operation. The
Exposed Pad of the 10-lead MSE package is also tied to
Pin 6 and the LTC1407/LTC1407A GND. The Exposed Pad
should be soldered on the PC board to reduce ground
connection inductance. Digital circuitry grounds must be
connected to the digital supply common.
Figure 4. LTC1407/LTC1407A Transfer Characteristic
INPUT VOLTAGE (V)
UNIPOLAR OUTPUT CODE
1407 F04
111...111
111...110
111...101
000...000
000...001
000...010
FS – 1LSB0
LTC1407/LTC1407A
15
1407fb
APPLICATIONS INFORMATION
POWER-DOWN MODES
Upon power-up, the LTC1407/LTC1407A are initialized to
the active state and are ready for conversion. The Nap and
Sleep mode waveforms show the power-down modes for
the LTC1407/LTC1407A. The SCK and CONV inputs control
the power-down modes (see Timing Diagrams). Two ris-
ing edges at CONV, without any intervening rising edges
at SCK, put the LTC1407/LTC1407A in Nap mode and the
power drain drops from 14mW to 6mW. The internal refer-
ence remains powered in Nap mode. One or more rising
edges at SCK wake up the LTC1407/LTC1407A for service
very quickly and CONV can start an accurate conversion
within a clock cycle.
Four rising edges at CONV, without any intervening rising
edges at SCK, put the LTC1407/LTC1407A in Sleep mode
and the power drain drops from 14mW to 10µW. To bring
the part out of Sleep mode requires one or more rising SCK
edges followed by a Nap request. Then one or more rising
edges at SCK wake up the LTC1407/LTC1407A for operation.
When Nap mode is entered after Sleep mode, the reference
that was shut down in Sleep mode is reactivated.
The internal reference (V
REF
) takes 2ms to slew and settle
with a 10µF load. Using Sleep mode more frequently com-
promises the settled accuracy of the internal reference.
Note that for slower conversion rates, the Nap and Sleep
modes can be used for substantial reductions in power
consumption.
Figure 5. Recommended Layout

LTC1407ACMSE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 14-Bit, 3Msps Simult. Sampling ADC
Lifecycle:
New from this manufacturer.
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