73S8014R-DB Datasheet 73S8014R-DB, 73S8014RN-DB, 73S8014RT-DB | P16-P18

73S8014R/RN/RT 20SO Demo Board User Manual UM_8014_010

16 Rev. 1.0

4 Appendix

This appendix includes the following tables and drawings of the PCB of the Evaluation Board:

• Electrical Schematic

• Bill of Materials

• Silk Screen Layer – Top side

• Silk Screen Layer – Bottom side

• Metal Layer – Top side

• Metal Layer – Middle 1, ground plane

• Metal Layer – Middle 2, supply plane

• Metal Layer – Bottom

UM_8014_010 73S8014R/RN/RT 20SO Demo Board User Manual

Rev. 1.0 17

Figure 4: TERIDIAN 73S8014R/RN/RT 20SO Demo Board: Electrical Schematic

PRES

GND

OFFB

SIO

GND

+5V

SCLK

+5V

S_C8

S_C4

SCLKSCLKSCLKSCLKSCLKSCLKSCLKSCLK

3.3V

TSM_110_01_L_SV

XTALOUTXTALOUTXTALOUTXTALOUT

C10

10uF

5V3VB/CMDVCC3B

C12

27pF

3.3V

VDD

TP1

5.0V

VDD

5.0V

C1 10uF

SSM_110_L_SV

CLKDIV1

I/OUC

CLKDIV2

R13

R10

TP3 to TP8 to be placed

very close to the pads

of J5

OFF

VCC

J1 and J3 are placed on the bottom. J2 and J4

are placed on the top side.

SW1

SW2

SIM/SAM Connector

RST

CLK

J1 must be aligned with J2 and J3 must be

aligned with J4 in order for this daughter

board to be stacked on another.

VDDF_ADJ

C1, C2, C8 and C5 must be

placed within 5mm of the U1

pins and connected by thick

track (wider than 0.5mm)

VDD

SELECT

CLK

RST

VCC

I/O

3.3V

5V3VB/CMDVCC3B

CLKDIV2

CLKDIV1

CMDVCCB/CMDVCC5B

GND

RSTIN

+3.3V

C2 0.1uF

CMDVCCB/CMDVCC5B

RSTIN

TP3

VCC

RST

CLK

GND

VPP

I/O

SW-1

SW-2

Smart Card Connector

R11

5.0V

R12

R8 to R13 and C36 to be

placed within 1cm of

J7.

SSM_110_L_SV

TP5

TP7

TP4

JP3

DNI

DNIDNI

DNI

DNIDNI

DNI

OFF

RSTIN

I/OUC

VPC

CLKDIV2

CMDVCC/CMDVCC5

5V_3V/CMDVCC3

VDDF_ADJ

GND

XTALIN

XTALOUT

GND

VDD

I/O

RST

GND

CLK

VCC

PRES

CLKDIV1

73S8014R(N)/RT

TSM_110_01_L_SV

10uF

20K

C11

1.0uF

JP1

XTALIN

SCLK

XTALIN

SELECT

XTAL

DNI

12.000MHz

22pF

VDD

22pF

VDD

0.1uF

When using an external clock

source, C7 should be removed.

73S8014R/RN/RT 20SO Demo Board User Manual UM_8014_010

18 Rev. 1.0

Table 6: TERIDIAN 73S8014R/RN/RT 20SO Demo Board: Bill of Material

Item Qty Reference Part

PCB Footprint

(see attached zip

file)

Digikey Part

Number

Part Number Manufactuer

1 3 C1, C3, C10 CAP 10UF 6.3V CERAMIC X5R 0805 805 PCC2225CT-ND ECJ-2FB0J106M Panasonic

2 1 C11 CAP 1.0UF 6.3V CERAMIC X5R 0603 603 PCC1915CT-ND ECJ-1VB0J105K Panasonic

3 2 C2, C8 CAP .1UF 16V CERAMIC X7R 0603 603 PCC1762CT-ND ECJ-1VB1C104K Panasonic

4 2 C12, C9 CAP CERAMIC 27PF 50V 0603 SMD 603 PCC270ACVCT-ND ECJ-1VC1H270J Panasonic

5 2 C4, C5 CAP CERAMIC 22PF 50V 0603 SMD 603 PCC220ACVCT-ND ECJ-1VC1H220J Panasonic

6 1 R7 RES ZERO OHM 1/10W 5% 0603 SMD 603 P0.0GCT-ND ERJ-3GEY0R00V Panasonic

7 1 R6 RES 20K OHM 1/10W 5% 0603 SMD 603 P20KGCT-ND ERJ-3GEYJ203V Panasonic

8 1 J6 CONN SMART CARD SIM/SAM 6PIN SMD

ITT_CCM03-

3013

401-1691-1-ND CCM03-3754 ITT Industries

9 1 J5 CONN SMART CARD 8PIN SMD CCM02-2504 401-1715-ND CCM02-2504LFT ITT Industries

10 5

TP1, TP3,

TP4, TP5, TP7

HEADER 2

2pins, 2.54mm

pich

S1011E-36-ND PZC36SAAN Sullins

11 2 JP1, JP3 HEADER 3

3pins, 2.54mm

pich

12 2 J1, J3 SSM_110_L_SV

SSM_110_L_

N/A SSM_110_L_SV Samtec

13 2 J2, J4 TSM_110_01_L_SV

TSM_110_01_

L_SV

N/A

TSM_110_01_L_S

Samtec

14 1 Y1 CRYSTAL 12.000 MHZ 20PF 49US HC-49US X190-ND ECS-120-20-4DN ENGYA

15 1 U1 73S8014R/RN/RT 73S8014R/RN/RT

Teridian

Semiconductor

Note: The resistors and capacitors marked DNI are not populated on the board. They can be implemented to adjust the features of the smart card

reader.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P24

73S8014R-DB

Mfr. #:

Buy 73S8014R-DB

Manufacturer:

Maxim Integrated

Description:

BOARD DEMO 73S8010R 20-SOIC

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

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73S8014R-DB

73S8014R-DB

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