ADP195 Data Sheet
Rev. C | Page 12 of 12
OUTLINE DIMENSIONS
110309-A
0.05 NOM
COPLANARITY
0.990
0.950
0.910
1.065
1.025
0.985
0.270
0.240
0.210
0.340
0.320
0.300
0.640
0.595
0.550
0.370
0.355
0.340
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
12
B
SEATING
PLANE
BALL A1
IDENTIFIER
0.50
REF
Figure 30. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-4)
Dimensions shown in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
6
1
4
3
0.35
0.30
0.25
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 REF
0.05 MAX
0.02 NOM
2.00
BSC SQ
0.65 BSC
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-11-2011-B
0.175 REF
Figure 31. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 x 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADP195ACBZ-R7 −40°C to +85°C 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-4 5Y
ADP195ACPZ-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-6-3 LJ6
ADP195-EVALZ Evaluation Board
ADP195-CP-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D08679-0-1/12(C)
