TB62747AFG/AFNG/AFNAG/BFNAG
2009-01-21
Absolute Maximum Ratings (T
a
25°C)
Characteristics Symbol Rating *1 Unit
Power supply voltage V
DD
−0.4 to 6.0 V
Output current I
O
55 mA
Logic input voltage V
IN
−0.3 to V
DD
+ 0.3 *2 V
Output voltage V
O
−0.3 to 26 V
Operating temperature T
opr
−40 to 85 °C
Storage temperature T
stg
−55 to 150 °C
Thermal resistance
Rth(j-a)
94 (AFG) *3, 120 (AFNG) *3, 80.07(AFNAG/BFNAG)
When mounted PCB
°C/W
Power dissipation P
D
*4
1.32 (AFG) *3, 1.04 (AFNG) *3, 1.56(AFNAG/BFNAG)
When mounted PCB
W
Note1: Voltage is ground referenced.
Note2: However, do not exceed 6V.
Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming)
Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each
degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).
Operating Conditions
DC Items (Unless otherwise specified, V
DD
= 3.0 to 5.5 V, T
a
=
40°C to 85°C)
Characteristics Symbol Test Conditions Min Typ. Max Unit
Power supply voltage V
DD
3.0 5.5 V
Output voltage when OFF V
O (ON)
0.4 4.0 V
High level logic input voltage V
IH
SIN,SCK,
,
0.7 ×
V
DD
V
DD
V
Low level logic input voltage V
IL
SIN,SCK,
,
GND
0.3 ×
V
DD
V
High level SOUT output current I
OH
−1 mA
Low level SOUT output current I
OL
1 mA
Constant current output
I
O1
, V
DD
= 3.3 V, V
O
= 0.4 to 1.0 V 1.5 35
mA
I
O2
, V
DD
= 5.0 V, V
O
= 0.4 to 1.2 V 1.5 45
AC Items (Unless otherwise specified, V
DD
= 3.0 to 5.5 V, T
a
=
40°C to 85°C)
Characteristics Symbol
Test
Circuits
Test Conditions Min Typ. Max Unit
Serial data transfer frequency f
SCK
6 25 MHz
Hold time
t
HOLD1
6 5 ns
t
HOLD2
6 5 ns
Setup time
t
SETUP1
6 5 ns
t
SETUP2
6 5 ns
Maximum clock rise time t
r
6 *1 500 ns
Maximum clock fall time t
f
6 *1 500 ns
Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock
waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind
when designing your application.