SMP18
REV. C
–3–
PIN CONNECTIONS
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
SMP18
CH
4
OUT
CH
0
OUT
CH
1
OUT
CH
2
OUT
V
DD
CH
6
OUT
INPUT
CH
7
OUT
B CONTROL
A CONTROL
CH
3
OUT
CH
5
OUT
INH
V
SS
DGND
C CONTROL
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
SMP18FP –40°C to +85°C Plastic DIP N-16
SMP18FRU –40°C to +85°C TSSOP-16 RU-16
SMP18FS –40°C to +85°C SO-16 R-16A
ABSOLUTE MAXIMUM RATINGS
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
LOGIC
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
V
IN
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
V
OUT
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SS
, V
DD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
(Not short-circuit protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type u
JA
* u
JC
Units
16-Pin Plastic DIP (P) 76 33 °C/W
16-Pin SOIC (S) 92 27 °C/W
16-Lead TSSOP (RU) 180 35 °C/W
NOTES
*θ
JA
is specified for worst case mounting conditions, i.e., θ
JA
is specified for device
in socket for plastic DIP packages; θ
JA
is specified for device soldered to printed
circuit board for SOIC and TSSOP packages.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP18 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
