13
FN7360.5
November 5, 2007
Thermal Management
The EL7554IRE is packaged in a thermally-efficient
HTSSOP-28 package, which utilizes the exposed thermal
pad at the bottom to spread heat through PCB metal.
Therefore:
1. The thermal pad must be soldered to the PCB
2. Maximize the PCB area
3. If a multiple layer PCB is used, thermal vias (13 to 25 mil)
must be placed underneath the thermal pad to connect to
ground plane(s). Do not place thermal reliefs on the vias.
Figure 25 shows a typical connection.
The thermal resistance for this package is as low as +26°C/W
for 2 layer PCB of 0.39" thickness (see Figure 9). The actual
junction temperature can be measured at V
TJ
pin.
The thermal performance of the IC is heavily dependent on
the layout of the PCB. The user should exercise care during
the design phase to ensure the IC will operate within the
recommended environmental conditions.
FIGURE 25. PCB LAYOUT - 28 Ld HTSSOP PACKAGE
Layout Considerations
The layout is very important for the converter to function
properly. Follow these tips for best performance:
1. Separate the Power Ground ( ) and Signal Ground ( );
connect them only at one point right at the SGND pin
2. Place the input capacitor(s) as close to V
IN
and PGND
pins as possible
3. Make as small as possible the loop from LX pins to L to
C
O
to PGND pins
4. Place R
1
and R
2
pins as close to the FB pin as possible
5. Maximize the copper area around the PGND pins; do not
place thermal relief around them
6. Thermal pad should be soldered to PCB. Place several
via holes under the chip to the ground plane to help heat
dissipation
The demo board is a good example of layout based on this
outline. Please refer to the EL7554 Application Brief.
GROUND PLANE
CONNECTION
COMPONENT SIDE
CONNECTION
EL7554
14
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7360.5
November 5, 2007
EL7554
HTSSOP (Heat-Sink TSSOP) Family
N
(N/2)+1
(N/2)
TOP VIEW
AD
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25 CABM
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10 CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
BOTTOM VIEW
EXPOSED
THERMAL PAD
E2
D1
MDP0048
HTSSOP (HEAT-SINK TSSOP) FAMILY
SYMBOL
MILLIMETERS
TOLERANCE14 LD 20 LD 24 LD 28 LD 38 LD
A 1.20 1.20 1.20 1.20 1.20 Max
A1 0.075 0.075 0.075 0.075 0.075 ±0.075
A2 0.90 0.90 0.90 0.90 0.90 +0.15/-0.10
b 0.25 0.25 0.25 0.25 0.22 +0.05/-0.06
c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06
D 5.00 6.50 7.80 9.70 9.70 ±0.10
D1 3.2 4.2 4.3 5.0 7.25 Reference
E 6.40 6.40 6.40 6.40 6.40 Basic
E1 4.40 4.40 4.40 4.40 4.40 ±0.10
E2 3.0 3.0 3.0 3.0 3.0 Reference
e 0.65 0.65 0.65 0.65 0.50 Basic
L 0.60 0.60 0.60 0.60 0.60 ±0.15
L1 1.00 1.00 1.00 1.00 1.00 Reference
N 1420242838Reference
Rev. 3 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at Datum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.

EL7554IREZ-T13

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Voltage Regulators LDFREE EL7554 6 AMP DC:DC STP DWNG
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union