MK2308S-1H

MK2308-1H
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER ZDB
IDT™ / ICS™
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER 4
MK2308-1H REV F 122109
AC Electrical Characteristics
VDD = 3.3 V ±10%, Ambient Temperature -40 to +85° C (Industrial), 0 to 70° C (Commercial)
Note 1: With CLKIN = 100 MHz, FBIN to CLKA4, all outputs at 100 MHz
Note 2: When there is no clock signal present at CLKIN, the MK2308-1H will enter power down mode. The PLL is
stopped and the outputs are tri-state.
Note 3: With VDD at a steady rate and valid clocks at CLKIN and FBIN
Thermal Characteristics 16TSSOP
Output High Voltage,
CMOS level
V
OH
I
OH
= -4 mA VDD-0.4 V
Operating Supply Current IDD No Load, S2 = 1, S1 = 1,
Note 1
70 mA
Power Down Supply
Current
IDDPD CLKIN = 0, S2 = 0, S1 = 1 12 µA
CLKIN = 0, Note 2 12 µA
Short Circuit Current I
OS
Each output ±70 mA
Input Capacitance C
IN
S2, S1, FBIN 5 pF
Parameter Symbol Conditions Min. Typ. Max. Units
Parameter Symbol Conditions Min. Typ. Max. Units
Input Clock Frequency f
IN
See table on page 2 10 133 MHz
Output Clock Frequency See table on page 2 10 133 MHz
Output Rise Time t
OR
0.8 to 2.0V, CL=30pF 1.5 ns
Output Fall Time t
OF
2.0 to 0.8V, CL=30pF 1.25 ns
Output Clock Duty Cycle t
DC
measured at VDD/2 45 50 55 %
Device to Device Skew rising edges at VDD/2 700 ps
Output to Output Skew rising edges at VDD/2 200 ps
Input to Output Skew rising edges at VDD/2, FBIN to
CLKA4, S1 = 1, S0 = 1, Note 1
±250 ps
Maximum Absolute JItter CL=15 pF, measured at 66.67M 130 ps
Cycle to Cycle Jitter CL=30 pF, measured at 66.67M 200 ps
CL=15 pF, measured at 66.67M 200 ps
CL=15 pF, measured at 133.33M 100 ps
PLL Lock Time Note 3 1.0 ms
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air 78 ° C/W
θ
JA
1 m/s air flow 70 ° C/W
θ
JA
3 m/s air flow 68 ° C/W
Thermal Resistance Junction to Case θ
JC
37 ° C/W
MK2308-1H
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER ZDB
IDT™ / ICS™
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER 5
MK2308-1H REV F 122109
Thermal Characteristics 16SOIC
Package Outline and Package Dimensions
(16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air 120 ° C/W
θ
JA
1 m/s air flow 115 ° C/W
θ
JA
3 m/s air flow 105 ° C/W
Thermal Resistance Junction to Case θ
JC
58 ° C/W
INDEX
AREA
1 2
16
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004)
C
C
L
H
h x 45
Millimeters Inches
Symbol Min Max Min Max
A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
B 0.330.51.013.020
C 0.19 0.25 .0075 .0098
D 9.80 10.00 .3859 .3937
E 3.80 4.00 .1497 .1574
e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
h 0.250.50.010.020
L 0.401.27.016.050
α 0° 8° 0° 8°
MK2308-1H
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER ZDB
IDT™ / ICS™
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER 6
MK2308-1H REV F 122109
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
16
D
E1
E
SEATING
PLANE
A
1
A
A
2
e
- C -
b
aaa C
c
L
Millimeters Inches
Symbol Min Max Min Max
A--1.20--0.047
A1 0.05 0.15 0.002 0.006
A2 0.80 1.05 0.032 0.041
b 0.19 0.30 0.007 0.012
C 0.09 0.20 0.0035 0.008
D 4.90 5.1 0.193 0.201
E 6.40 BASIC 0.252 BASIC
E1 4.30 4.50 0.169 0.177
e 0.65 Basic 0.0256 Basic
L 0.45 0.75 0.018 0.030
α 0° 8° 0° 8°
aaa -- 0.10 -- 0.004

MK2308S-1H

Mfr. #:
Manufacturer:
Description:
IC PLL ZD BUFFER HS 16-SOIC
Lifecycle:
New from this manufacturer.
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