MX0912B351Y,114

DATA SHEET
Product specification
Supersedes data of November 1994
1997 Feb 19
DISCRETE SEMICONDUCTORS
MX0912B351Y
NPN microwave power transistor
1997 Feb 19 2
Philips Semiconductors Product specification
NPN microwave power transistor MX0912B351Y
FEATURES
Interdigitated structure; high emitter efficiency
Diffused emitter ballasting resistors providing excellent
current sharing and withstanding a high VSWR
Gold metallization realizes very stable characteristics
and excellent lifetime
Multicell geometry gives good balance of dissipated
power and low thermal resistance
Input and output matching cell allows an easier design
of circuits.
APPLICATIONS
Intended for use in common base class C broadband
pulse power amplifier from 960 to 1215 MHz for TACAN
application.
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in
a SOT439A metal ceramic flange package, with base
connected to flange. It is mounted in common base
configuration and specified in class C.
PINNING - SOT439A
PIN DESCRIPTION
1 collector
2 emitter
3 base connected to flange
Fig.1 Simplified outline and symbol.
o
lumns
e
c
b
MAM045
1
2
Top view
33
QUICK REFERENCE DATA
Microwave performance up to T
mb
=25°C in a common base class C broadband amplifier.
MODE OF
OPERATION
f
(GHz)
V
CC
(V)
P
L
(W)
G
po
(dB)
η
C
(%)
Z
i
/Z
L
()
Class C
t
p
=10µs; δ = 10%
0.960 to 1.215 50 >325 >7 >40 see Figs 7 and 8
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1997 Feb 19 3
Philips Semiconductors Product specification
NPN microwave power transistor MX0912B351Y
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Up to 0.2 mm from ceramic.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter 65 V
V
CES
collector-emitter voltage R
BE
=0Ω−60 V
V
CEO
collector-emitter voltage open base 20 V
V
EBO
emitter-base voltage open collector 3V
I
C
collector current t
p
10 µs; δ≤10% 21 A
P
tot
total power dissipation
(peak power)
T
mb
=75°C; t
p
10 µs; δ≤10% 960 W
T
stg
storage temperature 65 +200 °C
T
j
operating junction temperature 200 °C
T
sld
soldering temperature t 10 s; note 1 235 °C
Fig.2 Maximum power dissipation derating as a
function of mounting base temperature.
t
p
=10µs; δ = 10%; P
tot max
= 960 W.
handbook, halfpage
50 200
1000
0
200
400
600
800
0
P
tot
(W)
100
T
mb
(°C)
MGL054

MX0912B351Y,114

Mfr. #:
Manufacturer:
Description:
RF TRANS NPN 20V 1.215GHZ CDFM2
Lifecycle:
New from this manufacturer.
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