Data Sheet ADRF5044
Rev. 0 | Page 5 of 14
ABSOLUTE MAXIMUM RATINGS
For recommended operating conditions, see Table 1.
Table 2.
Parameter Rating
Supply Voltage
Positive −0.3 V to +3.6 V
Negative −3.6 V to +0.3 V
Digital Control Input Voltage −0.3 V to V
DD
+ 0.3 V
RFx Input Power
1
(f = 400 MHz to 30 GHz,
CASE
Terminated Path 25 dBm
Hot Switching 22 dBm
Temperature
Junction, T
J
135°C
Storage Range −65°C to +150°C
Reflow (Moisture Sensitivity Level 3
(MSL3) Rating)
260°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
RFC and RF1 to RF4 Pins 375 V
1
For power derating less than 400 MHz, see Figure 2 and Figure 3.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JC
is the junction to case bottom (channel to package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JC
Unit
CC-24-4
Terminated Path 160 °C/W
POWER DERATING CURVES
4
–14
–12
–10
–8
–6
–4
–2
0
2
10k 100k 1M 10M
100M
1G 10G
100G
POWER DERATING (dB)
FREQUENCY (Hz)
16313-002
Figure 2. Power Derating for Through Path and Hot Switching vs. Frequency,
T
CASE
= 85°C
4
–14
–12
–10
–8
–6
–4
–2
0
2
10k 100k
1M 10M
100M 1G 10G 100G
POWER DERATING (dB)
FREQUENCY (Hz)
16313-003
Figure 3. Power Derating for Terminated Path vs. Frequency, T
CASE
= 85°C
ESD CAUTION
