MAX8552
High-Speed, Wide-Input,
Single-Phase MOSFET Driver
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Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
6, 8, &10L, DFN THIN.EPS
H
1
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
COMMON DIMENSIONS
SYMBOL
MIN. MAX.
A 0.70 0.80
D 2.90 3.10
E 2.90 3.10
A1
0.00 0.05
L 0.20 0.40
PKG. CODE N D2 E2 e JEDEC SPEC b [(N/2)-1] x e
PACKAGE VARIATIONS
0.25 MIN.k
A2 0.20 REF.
2.30±0.101.50±0.106T633-1 0.95 BSC MO229 / WEEA 1.90 REF0.40±0.05
1.95 REF0.30±0.050.65 BSC2.30±0.108T833-1
2.00 REF0.25±0.050.50 BSC2.30±0.1010T1033-1
2.40 REF0.20±0.05- - - - 0.40 BSC1.70±0.10 2.30±0.1014T1433-1
1.50±0.10
1.50±0.10
MO229 / WEEC
MO229 / WEED-3
0.40 BSC - - - - 0.20±0.05 2.40 REFT1433-2 14 2.30±0.101.70±0.10
T633-2 6 1.50±0.10 2.30±0.10
0.95 BSC MO229 / WEEA
0.40±0.05 1.90 REF
T833-2 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
T833-3 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF
-DRAWING NOT TO SCALE-
H
2
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
2.30±0.10
MO229 / WEED-3
2.00 REF0.25±0.05
0.50 BSC
1.50±0.1010T1033-2
