TB67H400AHG
2016-12-22
16
Electrical characteristics 1 (Ta=25°C and VM=24 V, unless otherwise specified)
Characteristics Symbol Test conditions Min Typ. Max Unit
Logic input voltage
High
VIN(H)
Logic input pins (Note)
2.0
5.5
V
Low
VIN(L)
Logic input pins (Note)
0
0.8
V
Logic input hysteresis voltage
VIN(HYS)
Logic input pins (Note)
100
300
mV
Logic input current
High
IIN(H)
Logic input pins:3.3 V
33
µA
Low
IIN(L)
Logic input pins:0 V
1
µA
Power consumption
IM1
Output: OPEN,
Standby mode
2 3.5 mA
IM2
Output: OPEN, PWM=H,
IN1, IN2=Low
3.5 5.5 mA
IM3
Output: OPEN
5.5
7
mA
Output leakage current
High
IOH
VRS=VM=50 V, Vout=0 V 1 µA
Low
IOL
VRS=VM=Vout=50 V
1
µA
Output current channel differential
ΔIout1
Bridge A, B differential
-5
0
5
%
Output current accuracy
ΔIout2
Iout=1.5 A
-5
0
5
%
RS pin current
IRS
VRS=VM=24 V
0
10
µA
Drain-source ON-resistance
(High side + low side)
Ron(H+L)
Tj=25°C, Forward direction
High side+Low side
Small mode
0.49 0.6 Ω
Note: VIN(H) is defined as the VIN voltage that causes the outputs (OUTA+, OUTA-, OUTB+ and OUTB-) to change
when a pin under test is gradually raised from 0 V. VIN(L) is defined as the VIN voltage that causes the outputs
(OUTA+, OUTA-, OUTB+ and OUTB-) to change when the pin is then gradually lowered.
The difference between VIN(H) and VIN(L) is defined as the VIN(HYS).
Note: The internal circuits are designed to avoid miss-function or leakage current; when the logic signal is applied
while the VM voltage is not supplied. But for fail-safe, please control the power supply and logic signal timing
correctly.
TB67H400AHG
2016-12-22
17
Electrical characteristics 2 (Ta=25°C and VM=24 V, unless otherwise specified)
Characteristics Symbol Test conditions Min Typ. Max Unit
Vref input current
Iref
Vref=2.0 V
0
1
μA
Internal regulator voltage
VCC
ICC=5.0 mA
4.75
5.0
5.25
V
Internal regulator current
ICC
VCC=5.0 V
2.5
5
mA
Vref gain rate
Vref(gain) Vref=2.0 V 1/5.2 1/5.0 1/4.8
TSD threshold (Note1)
T
j
TSD
145
160
175
°C
VM power on reset voltage
VMR
7.0
8.0
9.0
V
Over current threshold (Note2)
ISD
4.1
4.9
5.7
A
Note1: Thermal shutdown (TSD) circuit
When the junction temperature of the device reaches the TSD threshold, the TSD circuit is triggered; the
internal reset circuit then turns off the output transistors. In order to avoid malfunction by switching etc.,
detection mask time is prepared inside IC. Once the TSD circuit is triggered, the device will be set to standby
mode, and can be cleared by reasserting the VM power source, or setting to standby mode (INA1, INA2, INB1,
INB2, PWMA, and PWMB=All Low). The TSD circuit is a backup function to detect a thermal error, therefore
is not recommended to be used aggressively.
Note2: Over-current shutdown (ISD) circuit
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then
turns off the output transistors. In order to avoid malfunction by switching etc., detection mask time is
prepared inside IC. Once the ISD circuit is triggered, the device will be set to standby mode, and can be
cleared by reasserting the VM power source, or setting to standby mode (INA1, INA2, INB1, INB2, PWMA,
and PWMB=All Low).
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor
current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise
above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB67H400AHG or other components will be
damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown
(ISD)
and Thermal Shutdown
(TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition
persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be removed
immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
TB67H400AHG
2016-12-22
18
AC electrical characteristics (Ta = 25°C, VM = 24 V, and 6.8 mH/5.7 Ω, unless otherwise
specified
)
Characteristics Symbol Test conditions Min Typ. Max Unit
Minimum phase pulse width
tLOGIC(min) 100
ns
twp 50
twn 50
Output transistor switching
characteristics
tr 30 80 130
ns
tf 40 90 140
tpLH(LOGIC) IN1, IN2, PWM - OUT 250 1200
tpHL(LOGIC) IN1, IN2, PWM - OUT 250 1200
Analog blanking time AtBLK
VM=24V, Iout=1.5 A
Analog tBLK
250 400 550 ns
Digital blanking time
DtBLK(L) TBLKAB:L, fOSCM=1120 kHz 3.6
μs
DtBLK(H)
TBLKAB:H, fOSCM=1120 kHz 5.4 μs
OSCM oscillation frequency
accuracy
ΔfOSCM COSC= 270 pF, ROSC =5.1 kΩ
-15 +15 %
OSC oscillation reference
frequency
fOSCM COSC= 270 pF, ROSC =5.1 kΩ
952 1120 1288 kHz
Chopping frequency
fchop
Output: Active(Iout=1.5 A),
fOSCM = 1120 kHz
70 kHz
AC characteristics timing chart
Please note that the timing charts or constants may be omitted or simplified for explanatory.
twp
twn
tpLH (LOGIC)
tpHL (LOGIC)
10%
90%
tr
90%
10%
tf
[LOGIC]
[OUT]
50%
50%
50%
50%
50%
tLOGIC

TB67H400AHG

Mfr. #:
Manufacturer:
Description:
Motor / Motion / Ignition Controllers & Drivers MONOLITHIC BRUSHED DC MOTOR DRIVER BiCD
Lifecycle:
New from this manufacturer.
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