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(Reference) Relation between the power dissipation and the ambient temperature
This value is dependent on a substrate pattern and mounting conditions. Moreover, when ambient temperature is
high, permissible power consumption becomes small.
Device alone conditions
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Package dimensions
HZIP25-P-1.00F
Unit: mm
Note: The tightening torque for the mounting bracket should be controlled between 0.4Nm to 0.6Nm.
Weight 7.6 g (typ.)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required at
the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these
examples of application circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of over-current
and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when
the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to
continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in
the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent
device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative
current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a
stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may
not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power
supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating,
and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or
combustion. In addition, do not use any device that has been inserted incorrectly.
Please take extra care when selecting external components (such as power amps and regulators) or external devices (for
instance, speakers). When large amounts of leak current occurs from capacitors, the DC output level may increase. If the
output is connected to devices such as speakers with low resist voltage, overcurrent or IC failure may cause smoke or
ignition. (The over-current may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a
Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.

TB67H400AHG

Mfr. #:
Manufacturer:
Description:
Motor / Motion / Ignition Controllers & Drivers MONOLITHIC BRUSHED DC MOTOR DRIVER BiCD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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