PR01, PR02, PR03
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Revision: 01-Mar-16
15
Document Number: 28729
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TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• IEC 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Climatic category LCT / UCT / 56 (rated temperature range:
lower category temperature, upper category temperature;
damp heat, steady state, test duration: 56 days) is valid.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In test procedures and requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE
(R
max.
)
4.4.1 - Visual examination No holes; clean surface; nodamage
4.4.2 - Dimensions (outline) Gauge (mm)
SeeStraight and Kinked Dimensions
tables
4.5 - Resistance ± 5 % R
4.6.1.1 - Insulation resistance
Maximum voltage (DC) after 1min;
metal block method
R
ins min.
: 10
4
M
4.7 - Voltage proof U
RMS
= U
ins
; 60 s No breakdown or flashover
4.8 -
Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C
± 250 ppm/K
4.16
21 (Ua
1
)
21 (Ub)
21 (Uc)
Robustness of
terminations
Tensile, bending, and torsion
No damage
R
max.
:± (0.5 %R +0.05)
4.17 20 (Ta) Solderability
+235°C; 2 s;
solder bath method; SnPb40
Good tinning
( 95 % covered, no visible damage)
+245°C; 3s;
solder bath method; SnAg3Cu0.5
Good tinning
( 95 % covered, no visible damage)
4.18.2 20 (Tb)
Resistance to
soldering heat
Unmounted components
(260 ± 5) °C; (10 ± 1) s
R
max.
:± (1 %R +0.05)
4.19 14 (Na)
Rapid change of
temperature
30min at -55 °C and
30min at +200 °C; 5cycles
No visual damage
PR01: R
max.
:± (1 %R +0.05)
PR02: R
max.
:± (1 %R +0.05)
PR03: R
max.
:± (2 %R +0.05)
4.20 29 (Eb) Bump 3x1500bumps in three directions; 40g
No damage
R
max.
:± (0.5 %R +0.05)
4.22 6 (Fc) Vibration
10 sweep cycles per direction;
10Hz to2000Hz;
1.5mm or 200 m/s
2
No damage
R
max.
:± (0.5 %R +0.05)
