HIP6013CBZ-T

10
Schottky Selection
Rectifier D2 conducts when the upper MOSFET Q1 is off.
The diode should be a Schottky type for low power losses.
The power dissipation in the Schottky rectifier is
approximated by:
In addition to power dissipation, package selection and
heatsink requirements are the main design tradeoffs in
choosing the Schottky rectifier. Since the three factors are
interrelated, the selection process is an iterative procedure.
The maximum junction temperature of the rectifier must
remain below the manufacturer’s specified value, typically
125
o
C. By using the package thermal resistance specification
and the Schottky power dissipation equation (shown above),
the junction temperature of the rectifier can be estimated. Be
sure to use the available airflow and ambient temperature to
determine the junction temperature rise.
+
-
FIGURE 10. UPPER GATE DRIVE - DIRECT V
CC
DRIVE OPTION
+12V
HIP6013
GND
UGATE
PHASE
BOOT
VCC
+5V OR LESS
NOTE:
V
G-S
V
CC
- 5V
Q1
D2
P
COND
= I
O
x V
f
x (1 - D)
Where: D is the duty cycle = V
O
/V
IN
, and
V
f
is the schottky forward voltage drop
HIP6013
11
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
HIP6013 DC-DC Converter Application Circuit
The figure below shows a DC-DC converter circuit for a
microprocessor application, originally designed to employ the
HIP6007 controller. Given the similarities between the
HIP6007 and HIP6013 controllers, the circuit can be
implemented using the HIP6013 controller without any
modifications. However, given the expanded reference
voltage tolerance range, the HIP6013-based converter may
require additional output capacitance. Detailed information on
the circuit, including a complete Bill-of-Materials and circuit
board description, can be found in application note AN9722.
See Intersil’s home page on the web: http://www.intersil.com.
HIP6013
RT
FB
COMP
SS
REF
GND
OSC
VCC
VIN
C1-5
L2
C6-11
0.1F
2x 1F
0.1F
1F
33pF
15K
1K
3x 680F
4x 1000F
UGATE
OCSET
PHASE
BOOT
SPARE
CR1
Q1
3.01K
1000pF
C13
R1
R3
R4
C16
C15
R5
C14
C12
C17-18
C19
R6
C20
4148
U1
RTN
12VCC
14
2
10
9
8
74
5
1
3
SPARE
JP1
CR3
1206
1206
V
OUT
RTN
ENABLE
R2
1K
COMP
TP1
PHASE
TP2
6
R7
10K
12
11
13
NC
NC
NC
SPARE
MONITOR AND
PROTECTION
+
-
+
-
Component Selection Notes:
C1-C3 - 3 each 680F 25W VDC, Sanyo MV-GX or equivalent.
C6-C9 - 4 each 1000F 6.3W VDC, Sanyo MV-GX or equivalent.
L1 - Core: Micrometals T60-52; Winding: 14 Turns of 17AWG.
CR1 - 1N4148 or equivalent.
CR3 - 15A, 35V Schottky, Motorola MBR1535CT or equivalent.
Q1 - Intersil MOSFET; RFP25N05.
FIGURE 11. DC-DC CONVERTER APPLICATION CIRCUIT
0.01F
HIP6013

HIP6013CBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers STD BUCK PWM/1 5%/14
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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