NXP Semiconductors Product specification
N-channel dual gate MOS-FETs BF904; BF904R
THERMAL CHARACTERISTICS
Notes
1. Device mounted on a printed-circuit board.
2. T
s
is the temperature at the soldering point of the source lead.
STATIC CHARACTERISTICS
T
j
=25°C unless otherwise specified.
Note
1. R
G1
connects gate 1 to V
GG
= 5 V; see Fig.20.
DYNAMIC CHARACTERISTICS
Common source; T
amb
=25°C; V
DS
= 5 V; V
G2-S
= 4 V; I
D
= 10 mA; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to ambient note 1
BF904 500 K/W
BF904R 550 K/W
R
th j-s
thermal resistance from junction to soldering point note 2
BF904 T
s
=92°C 290 K/W
BF904R T
s
=78°C 360 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
(BR)G1-SS
gate 1-source breakdown voltage V
G2-S
=V
DS
= 0; I
G1-S
= 10 mA 6 15 V
V
(BR)G2-SS
gate 2-source breakdown voltage V
G1-S
=V
DS
= 0; I
G2-S
= 10 mA 6 15 V
V
(F)S-G1
forward source-gate 1 voltage V
G2-S
=V
DS
= 0; I
S-G1
= 10 mA 0.5 1.5 V
V
(F)S-G2
forward source-gate 2 voltage V
G1-S
=V
DS
= 0; I
S-G2
= 10 mA 0.5 1.5 V
V
G1-S(th)
gate 1-source threshold voltage V
G2-S
=4V; V
DS
=5V; I
D
=20µA 0.3 1 V
V
G2-S(th)
gate 2-source threshold voltage V
G1-S
=V
DS
=5V; I
D
=20µA 0.3 1.2 V
I
DSX
drain-source current V
G2-S
=4V; V
DS
=5V;
R
G1
= 120 kΩ; note 1
813mA
I
G1-SS
gate 1 cut-off current V
G2-S
=V
DS
= 0; V
G1-S
=5V − 50 nA
I
G2-SS
gate 2 cut-off current V
G1-S
=V
DS
= 0; V
G2-S
=5V − 50 nA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
y
fs
forward transfer admittance pulsed; T
j
=25°C 222530mS
C
ig1-s
input capacitance at gate 1 f = 1 MHz − 2.2 2.6 pF
C
ig2-s
input capacitance at gate 2 f = 1 MHz 1 1.5 2 pF
C
os
drain-source capacitance f = 1 MHz 1 1.3 1.6 pF
C
rs
reverse transfer capacitance f = 1 MHz − 25 35 fF
F noise figure f = 200 MHz; G
S
= 2 mS; B
S
=B
Sopt
− 1 1.5 dB
f = 800 MHz; G
S
=G
Sopt
; B
S
=B
Sopt
− 2 2.8 dB
Rev. 06 - 13 November 2007